F-RAM 4Kb Serial SPI 3V FRAM
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Cypress Semiconductor |
| Parts packaging code | DFN |
| package instruction | HVSON, SOLCC8,.16,37 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| JESD-30 code | R-PDSO-N8 |
| JESD-609 code | e3 |
| length | 4.5 mm |
| memory density | 4096 bit |
| Memory IC Type | MEMORY CIRCUIT |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Encapsulate equivalent code | SOLCC8,.16,37 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.85 mm |
| Maximum standby current | 0.000006 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.95 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 4 mm |
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