FPGA - Field Programmable Gate Array 9.7K LUTs 188 IO 1.2 V -4 Spd
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Lattice |
Parts packaging code | BGA |
package instruction | 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FPBGA-256 |
Contacts | 256 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
maximum clock frequency | 375 MHz |
Combined latency of CLB-Max | 0.53 ns |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
length | 17 mm |
Humidity sensitivity level | 3 |
Configurable number of logic blocks | 1216 |
Number of entries | 188 |
Number of logical units | 1216 |
Output times | 188 |
Number of terminals | 256 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | |
organize | 1216 CLBS |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA256,16X16,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 1.2 V |
Programmable logic type | FIELD PROGRAMMABLE GATE ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.1 mm |
Maximum supply voltage | 1.26 V |
Minimum supply voltage | 1.14 V |
Nominal supply voltage | 1.2 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
width | 17 mm |