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ADC1213S125HN-C1

Description
Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 125MSPS
CategoryAnalog mixed-signal IC    converter   
File Size661KB,37 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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ADC1213S125HN-C1 Overview

Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 125MSPS

ADC1213S125HN-C1 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeVFQFPN
package instruction7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32
Contacts32
Manufacturer packaging codeNDG32
Reach Compliance Codecompliant
Maximum analog input voltage2 V
Converter typeADC, PROPRIETARY METHOD
JESD-30 codeS-PQCC-N32
JESD-609 codee1
Maximum linear error (EL)0.12%
Number of digits12
Number of functions1
Number of terminals32
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output bit codeOFFSET BINARY
Package body materialPLASTIC/EPOXY
encapsulated codeQCCN
Encapsulate equivalent codeLCC32,.27SQ,25
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)260
power supply1.8,3 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formNO LEAD
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED

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Description Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 125MSPS Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 80MSPS Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code VFQFPN VFQFPN VFQFPN VFQFPN
package instruction 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 ,
Contacts 32 32 32 32
Manufacturer packaging code NDG32 NDG32 NDG32 NDG32
Reach Compliance Code compliant compliant compliant compliant
Converter type ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD
JESD-609 code e1 e1 e1 e1
Output bit code OFFSET BINARY OFFSET BINARY OFFSET BINARY OFFSET BINARY
Peak Reflow Temperature (Celsius) 260 260 260 260
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum analog input voltage 2 V 2 V 2 V -
JESD-30 code S-PQCC-N32 S-PQCC-N32 S-PQCC-N32 -
Maximum linear error (EL) 0.12% 0.12% 0.12% -
Number of digits 12 12 12 -
Number of functions 1 1 1 -
Number of terminals 32 32 32 -
Maximum operating temperature 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code QCCN QCCN QCCN -
Encapsulate equivalent code LCC32,.27SQ,25 LCC32,.27SQ,25 LCC32,.27SQ,25 -
Package shape SQUARE SQUARE SQUARE -
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER -
power supply 1.8,3 V 1.8,3 V 1.8,3 V -
Certification status Not Qualified Not Qualified Not Qualified -
surface mount YES YES YES -
technology CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal form NO LEAD NO LEAD NO LEAD -
Terminal pitch 0.635 mm 0.635 mm 0.635 mm -
Terminal location QUAD QUAD QUAD -

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