|
ADC1213S065HN-C18 |
ADC1213S080HN-C1 |
ADC1213S125HN-C1 |
ADC1213S065HN-C1 |
Description |
Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS |
Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 80MSPS |
Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 125MSPS |
Analog to Digital Converters - ADC SINGLE CHANNEL 12BITS ADC 65MSPS |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
Parts packaging code |
VFQFPN |
VFQFPN |
VFQFPN |
VFQFPN |
package instruction |
, |
7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 |
7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 |
7 X 7 MM, 0.80 MM HEIGHT, PLASTIC, SOT1152-1, HVQFN-32 |
Contacts |
32 |
32 |
32 |
32 |
Manufacturer packaging code |
NDG32 |
NDG32 |
NDG32 |
NDG32 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
Converter type |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
Output bit code |
OFFSET BINARY |
OFFSET BINARY |
OFFSET BINARY |
OFFSET BINARY |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
TIN SILVER COPPER |
TIN SILVER COPPER |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Maximum analog input voltage |
- |
2 V |
2 V |
2 V |
JESD-30 code |
- |
S-PQCC-N32 |
S-PQCC-N32 |
S-PQCC-N32 |
Maximum linear error (EL) |
- |
0.12% |
0.12% |
0.12% |
Number of digits |
- |
12 |
12 |
12 |
Number of functions |
- |
1 |
1 |
1 |
Number of terminals |
- |
32 |
32 |
32 |
Maximum operating temperature |
- |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
QCCN |
QCCN |
QCCN |
Encapsulate equivalent code |
- |
LCC32,.27SQ,25 |
LCC32,.27SQ,25 |
LCC32,.27SQ,25 |
Package shape |
- |
SQUARE |
SQUARE |
SQUARE |
Package form |
- |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
power supply |
- |
1.8,3 V |
1.8,3 V |
1.8,3 V |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
surface mount |
- |
YES |
YES |
YES |
technology |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
- |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal pitch |
- |
0.635 mm |
0.635 mm |
0.635 mm |
Terminal location |
- |
QUAD |
QUAD |
QUAD |