HY5DS113222FM-4 datasheet, PDF

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HY5DS113222FM-4: Description512M(16Mx32) GDDR SDRAM; Categorystorage storage; File Size426KB，30 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY5DS113222FM-4 Overview

512M(16Mx32) GDDR SDRAM

HY5DS113222FM-4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	BGA
package instruction	LFBGA, BGA144,12X12,32
Contacts	144
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	250 MHz
I/O type	COMMON
interleaved burst length	2,4,8
JESD-30 code	S-PBGA-B144
length	12 mm
memory density	536870912 bi
Memory IC Type	DDR DRAM
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	144
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA144,12X12,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.3 mm
self refresh	YES
Continuous burst length	2,4,8
Maximum standby current	0.05 A
Maximum slew rate	0.62 mA
Maximum supply voltage (Vsup)	2.1 V
Minimum supply voltage (Vsup)	1.75 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12 mm

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HY5DS113222FM(P)

512M(16Mx32) GDDR SDRAM

HY5DS113222FM(P)

This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any respon-

sibility for use of circuits described. No patent licenses are implied.

Rev. 0.1 / Oct. 2004

HY5DS113222FM(P)

PIN DESCRIPTION

CK, /CK

TYPE

Input

DESCRIPTION

Clock: CK and /CK are differential clock inputs. All address and control input signals are

sampled on the crossing of the positive edge of CK and negative edge of /CK. Output

(read) data is referenced to the crossings of CK and /CK (both directions of crossing).

Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, and

device input buffers and output drivers. Taking CKE LOW provides PRECHARGE POWER

DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER DOWN (row

ACTIVE in any bank). CKE is synchronous for POWER DOWN entry and exit, and for SELF

REFRESH entry. CKE is asynchronous for SELF REFRESH exit, and for output disable. CKE

must be maintained high throughout READ and WRITE accesses. Input buffers, excluding

CK, /CK and CKE are disabled during POWER DOWN. Input buffers, excluding CKE are

disabled during SELF REFRESH. CKE is an SSTL_2 input, but will detect an LVCMOS LOW

level after Vdd is applied.

Chip Select : Enables or disables all inputs except CK, /CK, CKE, DQS and DM. All com-

mands are masked when CS0 or CS1 is registered high. CS0 or CS1 provides for external

bank selection on systems with multiple banks. CS0 and CS1 are considered part of the

command code. When it is the operationg state of MRS, Power up sequence, EMRS, it

should be enabled in pairs. Except this case, it can be operated, individually.

Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, Read, Write or PRE-

CHARGE command is being applied.

Address Inputs: Provide the row address for ACTIVE commands, and the column address

and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the

memory array in the respective bank. A8 is sampled during a precharge command to

determine whether the PRECHARGE applies to one bank (A8 LOW) or all banks (A8

HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The

address inputs also provide the op code during a MODE REGISTER SET command. BA0

and BA1 define which mode register is loaded during the MODE REGISTER SET command

(MRS or EMRS).

Command Inputs: /RAS, /CAS and /WE (along with /CS) define the command being

entered.

Input Data Mask: DM(0~3) is an input mask signal for write data. Input data is masked

when DM is sampled HIGH along with that input data during a WRITE access. DM is sam-

pled on both edges of DQS. Although DM pins are input only, the DM loading matches the

DQ and DQS loading. DM0 corresponds to the data on DQ0-Q7; DM1 corresponds to the

data on DQ8-Q15; DM2 corresponds to the data on DQ16-Q23; DM3 corresponds to the

data on DQ24-Q31.

Data Strobe: Output with read data, input with write data. Edge aligned with read data,

centered in write data. Used to capture write data. DQS0 corresponds to the data on

DQ0-Q7; DQS1 corresponds to the data on DQ8-Q15; DQS2 corresponds to the data on

DQ16-Q23; DQS3 corresponds to the data on DQ24-Q31

Data input / output pin : Data Bus

Power supply for internal circuits and input buffers.

Power supply for output buffers for noise immunity.

Reference voltage for inputs for SSTL interface.

No connection.

CKE

Input

/CS0, /CS1

Input

BA0, BA1

Input

A0 ~ A11

Input

/RAS, /CAS, /WE

Input

DM0 ~ DM3

Input

DQS0 ~ DQS3

I/O

DQ0 ~ DQ31

DDQ

SSQ

REF

I/O

Supply

Rev. 0.1 / Oct. 2004

HY5DS113222FM-4 Related Products

	HY5DS113222FM-4	HY5DS113222FM	HY5DS113222FM-28	HY5DS113222FM-33	HY5DS113222FM-36	HY5DS113222FMP-33	HY5DS113222FMP-28	HY5DS113222FMP-36	HY5DS113222FMP-4
Description	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM	512M(16Mx32) GDDR SDRAM
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	conform to	conform to	conform to	conform to
Maker	SK Hynix	-	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	BGA	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	LFBGA, BGA144,12X12,32	-	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32	LFBGA, BGA144,12X12,32
Contacts	144	-	144	144	144	144	144	144	144
Reach Compliance Code	compli	-	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	0.6 ns	-	0.6 ns	0.6 ns	0.6 ns	0.6 ns	0.6 ns	0.6 ns	0.6 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	250 MHz	-	350 MHz	300 MHz	275 MHz	300 MHz	350 MHz	275 MHz	250 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
interleaved burst length	2,4,8	-	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8
JESD-30 code	S-PBGA-B144	-	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
length	12 mm	-	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm
memory density	536870912 bi	-	536870912 bi	536870912 bi	536870912 bi	536870912 bi	536870912 bi	536870912 bi	536870912 bi
Memory IC Type	DDR DRAM	-	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	32	-	32	32	32	32	32	32	32
Number of functions	1	-	1	1	1	1	1	1	1
Number of ports	1	-	1	1	1	1	1	1	1
Number of terminals	144	-	144	144	144	144	144	144	144
word count	16777216 words	-	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	-	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16MX32	-	16MX32	16MX32	16MX32	16MX32	16MX32	16MX32	16MX32
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	-	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA144,12X12,32	-	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32	BGA144,12X12,32
Package shape	SQUARE	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	260	260	260	260
power supply	1.8 V	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	-	4096	4096	4096	4096	4096	4096	4096
Maximum seat height	1.3 mm	-	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm	1.3 mm
self refresh	YES	-	YES	YES	YES	YES	YES	YES	YES
Continuous burst length	2,4,8	-	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8
Maximum standby current	0.05 A	-	0.05 A	0.05 A	0.05 A	0.05 A	0.05 A	0.05 A	0.05 A
Maximum slew rate	0.62 mA	-	0.81 mA	0.7 mA	0.63 mA	0.7 mA	0.81 mA	0.63 mA	0.62 mA
Maximum supply voltage (Vsup)	2.1 V	-	2.1 V	2.1 V	2.1 V	2.1 V	2.1 V	2.1 V	2.1 V
Minimum supply voltage (Vsup)	1.75 V	-	1.75 V	1.75 V	1.75 V	1.75 V	1.75 V	1.75 V	1.75 V
Nominal supply voltage (Vsup)	1.8 V	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	-	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	BALL	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	20	20	20	20
width	12 mm	-	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm

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