74SSTU32864GBFG8 datasheet, PDF

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74SSTU32864GBFG8: DescriptionRegisters DDR II REGISTER; Categorylogic logic; File Size171KB，12 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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Registers DDR II REGISTER

74SSTU32864GBFG8 Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	CABGA
package instruction	BGA, BGA96,6X16,32
Contacts	96
Manufacturer packaging code	BFG96
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
series	SSTU
JESD-30 code	R-PBGA-B96
JESD-609 code	e1
Logic integrated circuit type	D FLIP-FLOP
Humidity sensitivity level	3
Number of digits	25
Number of functions	1
Number of terminals	96
Maximum operating temperature	70 °C
Minimum operating temperature
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA96,6X16,32
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	1.8 V
propagation delay (tpd)	2.35 ns
Certification status	Not Qualified
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
Trigger type	POSITIVE EDGE
minfmax	340 MHz
Base Number Matches	1

74SSTU32864GBFG8 Related Products

	74SSTU32864GBFG8	74SSTU32864CBFG8	74SSTU32864DBFG8	74SSTU32864GBFG	74SSTU32864BFG8	74SSTU32864BFG	74SSTU32864DBFG
Description	Registers DDR II REGISTER	Registers DDR II REGISTER	Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O	Registers DDR II REGISTER	Registers DDR II REGISTAR	Registers DDR II REGISTAR	Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	CABGA	CABGA	CABGA	CABGA	CABGA	CABGA	CABGA
package instruction	BGA, BGA96,6X16,32	GREEN, LFBGA-96	BGA, BGA96,6X16,32	BGA, BGA96,6X16,32	BGA, BGA96,6X16,32	BGA, BGA96,6X16,32	BGA, BGA96,6X16,32
Contacts	96	96	96	96	96	96	96
Manufacturer packaging code	BFG96	BFG96	BFG96	BFG96	BFG96	BFG96	BFG96
Reach Compliance Code	compliant	compliant	unknown	compliant	compliant	compliant	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Other features	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
series	SSTU	SSTU	SSTU	SSTU	SSTU	SSTU	SSTU
JESD-30 code	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96
JESD-609 code	e1	e1	e1	e1	e1	e1	e1
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP
Humidity sensitivity level	3	3	3	3	3	3	3
Number of digits	25	25	25	25	25	25	25
Number of functions	1	1	1	1	1	1	1
Number of terminals	96	96	96	96	96	96	96
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA96,6X16,32	BGA96,6X16,32	BGA96,6X16,32	BGA96,6X16,32	BGA96,6X16,32	BGA96,6X16,32	BGA96,6X16,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260
power supply	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
propagation delay (tpd)	2.35 ns	2.35 ns	2.35 ns	2.35 ns	2.35 ns	2.35 ns	2.35 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	NOT SPECIFIED	30	30	30	NOT SPECIFIED
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
minfmax	340 MHz	340 MHz	340 MHz	340 MHz	340 MHz	340 MHz	340 MHz
Base Number Matches	1	1	1	1	1	1	1

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