|
74SSTU32864CBFG8 |
74SSTU32864GBFG8 |
74SSTU32864DBFG8 |
74SSTU32864GBFG |
74SSTU32864BFG8 |
74SSTU32864BFG |
74SSTU32864DBFG |
Description |
Registers DDR II REGISTER |
Registers DDR II REGISTER |
Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O |
Registers DDR II REGISTER |
Registers DDR II REGISTAR |
Registers DDR II REGISTAR |
Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
Parts packaging code |
CABGA |
CABGA |
CABGA |
CABGA |
CABGA |
CABGA |
CABGA |
package instruction |
GREEN, LFBGA-96 |
BGA, BGA96,6X16,32 |
BGA, BGA96,6X16,32 |
BGA, BGA96,6X16,32 |
BGA, BGA96,6X16,32 |
BGA, BGA96,6X16,32 |
BGA, BGA96,6X16,32 |
Contacts |
96 |
96 |
96 |
96 |
96 |
96 |
96 |
Manufacturer packaging code |
BFG96 |
BFG96 |
BFG96 |
BFG96 |
BFG96 |
BFG96 |
BFG96 |
Reach Compliance Code |
compliant |
compliant |
unknown |
compliant |
compliant |
compliant |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Other features |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
14 BIT 1:2 CONFIGURATION ALSO POSSIBLE |
series |
SSTU |
SSTU |
SSTU |
SSTU |
SSTU |
SSTU |
SSTU |
JESD-30 code |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
R-PBGA-B96 |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
e1 |
Logic integrated circuit type |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
D FLIP-FLOP |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
Number of digits |
25 |
25 |
25 |
25 |
25 |
25 |
25 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
96 |
96 |
96 |
96 |
96 |
96 |
96 |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
BGA |
Encapsulate equivalent code |
BGA96,6X16,32 |
BGA96,6X16,32 |
BGA96,6X16,32 |
BGA96,6X16,32 |
BGA96,6X16,32 |
BGA96,6X16,32 |
BGA96,6X16,32 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
260 |
power supply |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
propagation delay (tpd) |
2.35 ns |
2.35 ns |
2.35 ns |
2.35 ns |
2.35 ns |
2.35 ns |
2.35 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum supply voltage (Vsup) |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
1.9 V |
Minimum supply voltage (Vsup) |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
Nominal supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
30 |
30 |
NOT SPECIFIED |
30 |
30 |
30 |
NOT SPECIFIED |
Trigger type |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
POSITIVE EDGE |
minfmax |
340 MHz |
340 MHz |
340 MHz |
340 MHz |
340 MHz |
340 MHz |
340 MHz |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |