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74SSTU32864CBFG8

Description
Registers DDR II REGISTER
Categorylogic    logic   
File Size171KB,12 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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74SSTU32864CBFG8 Overview

Registers DDR II REGISTER

74SSTU32864CBFG8 Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeCABGA
package instructionGREEN, LFBGA-96
Contacts96
Manufacturer packaging codeBFG96
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
Other features14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
seriesSSTU
JESD-30 codeR-PBGA-B96
JESD-609 codee1
Logic integrated circuit typeD FLIP-FLOP
Humidity sensitivity level3
Number of digits25
Number of functions1
Number of terminals96
Maximum operating temperature70 °C
Minimum operating temperature
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA96,6X16,32
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1.8 V
propagation delay (tpd)2.35 ns
Certification statusNot Qualified
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Trigger typePOSITIVE EDGE
minfmax340 MHz
Base Number Matches1

74SSTU32864CBFG8 Related Products

74SSTU32864CBFG8 74SSTU32864GBFG8 74SSTU32864DBFG8 74SSTU32864GBFG 74SSTU32864BFG8 74SSTU32864BFG 74SSTU32864DBFG
Description Registers DDR II REGISTER Registers DDR II REGISTER Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O Registers DDR II REGISTER Registers DDR II REGISTAR Registers DDR II REGISTAR Registers 1:1 and 1:2 Registered Buffer with 1.8V SSTL I/O
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Lead free Lead free Lead free Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code CABGA CABGA CABGA CABGA CABGA CABGA CABGA
package instruction GREEN, LFBGA-96 BGA, BGA96,6X16,32 BGA, BGA96,6X16,32 BGA, BGA96,6X16,32 BGA, BGA96,6X16,32 BGA, BGA96,6X16,32 BGA, BGA96,6X16,32
Contacts 96 96 96 96 96 96 96
Manufacturer packaging code BFG96 BFG96 BFG96 BFG96 BFG96 BFG96 BFG96
Reach Compliance Code compliant compliant unknown compliant compliant compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
series SSTU SSTU SSTU SSTU SSTU SSTU SSTU
JESD-30 code R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
JESD-609 code e1 e1 e1 e1 e1 e1 e1
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Humidity sensitivity level 3 3 3 3 3 3 3
Number of digits 25 25 25 25 25 25 25
Number of functions 1 1 1 1 1 1 1
Number of terminals 96 96 96 96 96 96 96
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
power supply 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
propagation delay (tpd) 2.35 ns 2.35 ns 2.35 ns 2.35 ns 2.35 ns 2.35 ns 2.35 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 NOT SPECIFIED 30 30 30 NOT SPECIFIED
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
minfmax 340 MHz 340 MHz 340 MHz 340 MHz 340 MHz 340 MHz 340 MHz
Base Number Matches 1 1 1 1 1 1 1

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