|
DG9262DY-T1 |
DG9263DQ-T1-E3 |
DG9262DY-T1-E3 |
DG9263DQ-T1 |
DG9263DY-T1 |
DG9262DQ-T1 |
Description |
Analog Switch ICs Dual SPST Switch |
Analog Switch ICs Dual SPST Switch |
Analog Switch ICs Dual SPST Switch |
Analog Switch ICs Dual SPST Switch |
Analog Switch ICs Dual SPST Switch |
Analog Switch ICs Dual SPST Switch |
Is it lead-free? |
Contains lead |
Lead free |
Lead free |
Contains lead |
Contains lead |
Contains lead |
Maker |
Vishay |
Vishay |
Vishay |
Vishay |
Vishay |
Vishay |
Parts packaging code |
SOIC |
TSSOP |
SOIC |
MSOP |
SOIC |
MSOP |
package instruction |
SOP, SOP8,.25 |
TSSOP, TSSOP8,.19 |
SOP, SOP8,.25 |
TSSOP, |
SOP, SOP8,.25 |
TSSOP, |
Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
Analog Integrated Circuits - Other Types |
SPST |
- |
SPST |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDSO-G8 |
- |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e0 |
- |
e3 |
e0 |
e0 |
e0 |
length |
4.9 mm |
- |
4.9 mm |
3 mm |
4.9 mm |
3 mm |
Number of channels |
1 |
- |
1 |
1 |
1 |
1 |
Number of functions |
2 |
- |
2 |
2 |
2 |
2 |
Number of terminals |
8 |
- |
8 |
8 |
8 |
8 |
Nominal off-state isolation |
74 dB |
- |
74 dB |
74 dB |
74 dB |
74 dB |
On-state resistance matching specifications |
0.4 Ω |
- |
0.4 Ω |
0.4 Ω |
0.4 Ω |
0.4 Ω |
Maximum on-state resistance (Ron) |
80 Ω |
- |
80 Ω |
80 Ω |
80 Ω |
80 Ω |
Maximum operating temperature |
85 °C |
- |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
- |
SOP |
TSSOP |
SOP |
TSSOP |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
Package form |
SMALL OUTLINE |
- |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
240 |
- |
260 |
240 |
240 |
240 |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
- |
1.75 mm |
1.1 mm |
1.75 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
12 V |
- |
12 V |
12 V |
12 V |
12 V |
Minimum supply voltage (Vsup) |
2.7 V |
- |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
- |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
- |
YES |
YES |
YES |
YES |
Maximum disconnect time |
120 ns |
- |
120 ns |
50 ns |
120 ns |
50 ns |
Maximum connection time |
200 ns |
- |
200 ns |
120 ns |
200 ns |
120 ns |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
- |
MATTE TIN |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
- |
1.27 mm |
0.65 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
- |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
- |
40 |
30 |
30 |
30 |
width |
3.9 mm |
- |
3.9 mm |
3 mm |
3.9 mm |
3 mm |
Base Number Matches |
1 |
- |
1 |
- |
1 |
1 |