AS6C2008-55TIN datasheet, PDF - EEWORLD Datasheet

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AS6C2008-55TIN: DescriptionSRAM 2M, 3.3V, 55ns 256K x 8 Asynch SRAM; Categorystorage storage; File Size3MB，13 Pages; ManufacturerAlliance Memory; Environmental Compliance

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AS6C2008-55TIN Overview

SRAM 2M, 3.3V, 55ns 256K x 8 Asynch SRAM

AS6C2008-55TIN Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	TSOP1
package instruction	TSOP1, TSSOP32,.8,20
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
length	18.4 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP32,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00001 A
Minimum standby current	1.5 V
Maximum slew rate	0.035 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	8 mm
Base Number Matches	1

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February 2007

AS6C2008

Rev. 1.1

256K X 8 BIT LOW POWER CMOS SRAM

GENERAL DESCRIPTION

The AS6C2008 is a 2,097,152-bit low power CMOS

static random access memory organized as 262,144

words by 8 bits. It is fabricated using very high

performance, high reliability CMOS technology. Its

standby current is stable within the range of

operating temperature.

The AS6C2008 is well designed for very low power

system applications, and particularly well suited for

battery back-up nonvolatile memory application.

The AS6C2008 operates from a single power

supply of 2.7V ~ 3.6V

FEATURES

Access time : 55ns

Low power consumption:

Operating current :20mA (TYP.)

Standby current : 20mA(TYP.)L Version

1µ

A (TYP.) LL-version

Single 2.7V ~ 3.6V power supply

Fully static operation

Tri-state output

Data retention voltage : 1.5V (MIN.)

All Products ROHS Compliant

Package : 32-pin 450 mil SOP

32-pin 8mm x 20mm TSOP-I

32-pin 8mm x 13.4mm sTSOP

36-ball 6mm x 8mm TFBGA

PRODUCT FAMILY

Product

Family

Operating

Temperature

Vcc Range

Speed

Power Dissipation

Standby(I

SB1,

TYP.) Operating(Icc,TYP.)

AS6C2008 (I)

-40 ~ 85ºC

.7 ~ 3.6V

55ns

20µA(L)/1µA(LL)

20mA

FUNCTIONAL BLOCK DIAGRAM

PIN DESCRIPTION

SYMBOL

DESCRIPTION

Address Inputs

Data Inputs/Outputs

Chip Enable Inputs

Write Enable Input

Output Enable Input

Power Supply

Ground

No Connection

A0 - A17

DQ0 – DQ7

CE#, CE2

WE#

OE#

Vcc

Vss

A0-A17

DECODER

256Kx8

MEMORY ARRAY

DQ0-DQ7

I/O DATA

CIRCUIT

COLUMN I/O

CE#

CE2

WE#

OE#

CONTROL

CIRCUIT

10/February/07, v.1.0

Alliance Memory Inc.

Page 1 of 13

AS6C2008-55TIN Related Products

	AS6C2008-55TIN	AS6C2008-55SIN	AS6C2008-55STIN	AS6C2008-55TINTR	AS6C2008-55BIN
Description	SRAM 2M, 3.3V, 55ns 256K x 8 Asynch SRAM	SRAM 2M, 2.7-3.6V, 55ns 256K x 8 Asynch SRAM	SRAM 2M, 3.3V, 55ns 256K x 8 Asynch SRAM	SRAM 2M, 3.3V, 55ns 256K x 8 Asynch SRAM	SRAM 2M, 2.7-3.6V, 55ns 256K x 8 Asynch SRAM
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
Peak Reflow Temperature (Celsius)	260	260	260	NOT SPECIFIED	260
Maximum time at peak reflow temperature	40	40	40	NOT SPECIFIED	40
Parts packaging code	TSOP1	SOIC	TSOP	-	BGA
package instruction	TSOP1, TSSOP32,.8,20	SOP, SOP32,.56	LSSOP, TSSOP32,.56,20	-	TFBGA, BGA36,6X8,30
Contacts	32	32	32	-	36
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	-	3A991.B.2.A
Maximum access time	55 ns	55 ns	55 ns	-	55 ns
I/O type	COMMON	COMMON	COMMON	-	COMMON
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	-	R-PBGA-B36
length	18.4 mm	-	11.8 mm	-	8 mm
memory density	2097152 bit	2097152 bit	2097152 bit	-	2097152 bit
memory width	8	8	8	-	8
Humidity sensitivity level	3	3	3	-	3
Number of functions	1	1	1	-	1
Number of terminals	32	32	32	-	36
word count	262144 words	262144 words	262144 words	-	262144 words
character code	256000	256000	256000	-	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C
organize	256KX8	256KX8	256KX8	-	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TSOP1	SOP	LSSOP	-	TFBGA
Encapsulate equivalent code	TSSOP32,.8,20	SOP32,.56	TSSOP32,.56,20	-	BGA36,6X8,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
power supply	3/3.3 V	3/3.3 V	3/3.3 V	-	3/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	1.2 mm	2.997 mm	1.25 mm	-	1.2 mm
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	-	0.00001 A
Minimum standby current	1.5 V	1.5 V	1.5 V	-	1.5 V
Maximum slew rate	0.035 mA	0.035 mA	0.035 mA	-	0.035 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	-	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	-	3 V
surface mount	YES	YES	YES	-	YES
technology	CMOS	CMOS	CMOS	-	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	-	BALL
Terminal pitch	0.5 mm	1.27 mm	0.5 mm	-	0.75 mm
Terminal location	DUAL	DUAL	DUAL	-	BOTTOM
width	8 mm	11.303 mm	8 mm	-	6 mm
Base Number Matches	1	1	-	1	1
Factory Lead Time	-	-	8 weeks	8 weeks	8 weeks

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