FIFO, 512X9, 35ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | AMD |
Parts packaging code | DIP |
package instruction | DIP, DIP28,.6 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Is Samacsys | N |
Maximum access time | 35 ns |
period time | 45 ns |
JESD-30 code | R-GDIP-T28 |
JESD-609 code | e0 |
length | 37.1475 mm |
memory density | 4608 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 512 words |
character code | 512 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512X9 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.588 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |
67C4501-35J | 67C4501-35N | 67C4501-50J | 67C4501-50NL | 67C4501-65J | 67C4501-65N | 67C4501-65NL | 67C4501-80J | 67C4501-80N | 67C4501-80NL | |
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Description | FIFO, 512X9, 35ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 35ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | FIFO, 512X9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 50ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 512X9, 65ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 65ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | FIFO, 512X9, 65ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 512X9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 512X9, 80ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 | FIFO, 512X9, 80ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
Parts packaging code | DIP | DIP | DIP | QFJ | DIP | DIP | QFJ | DIP | DIP | QFJ |
package instruction | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 |
Contacts | 28 | 28 | 28 | 32 | 28 | 28 | 32 | 28 | 28 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 35 ns | 35 ns | 50 ns | 50 ns | 65 ns | 65 ns | 65 ns | 80 ns | 80 ns | 80 ns |
period time | 45 ns | 45 ns | 65 ns | 65 ns | 80 ns | 80 ns | 80 ns | 100 ns | 100 ns | 100 ns |
JESD-30 code | R-GDIP-T28 | R-PDIP-T28 | R-GDIP-T28 | R-PQCC-J32 | R-GDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-GDIP-T28 | R-PDIP-T28 | R-PQCC-J32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 37.1475 mm | 37.084 mm | 37.1475 mm | 13.97 mm | 37.1475 mm | 37.084 mm | 13.97 mm | 37.1475 mm | 37.084 mm | 13.97 mm |
memory density | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit | 4608 bit |
Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 32 | 28 | 28 | 32 | 28 | 28 | 32 |
word count | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
character code | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | QCCJ | DIP | DIP | QCCJ | DIP | DIP | QCCJ |
Encapsulate equivalent code | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.588 mm | 5.715 mm | 5.588 mm | 3.556 mm | 5.588 mm | 5.715 mm | 3.556 mm | 5.588 mm | 5.715 mm | 3.556 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES | NO | NO | YES | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Is Samacsys | N | - | N | N | N | N | N | N | N | N |