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67C4501-35J

Description
FIFO, 512X9, 35ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28
Categorystorage   
File Size287KB,8 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

67C4501-35J Overview

FIFO, 512X9, 35ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28

67C4501-35J Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeDIP
package instructionDIP, DIP28,.6
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Maximum access time35 ns
period time45 ns
JESD-30 codeR-GDIP-T28
JESD-609 codee0
length37.1475 mm
memory density4608 bit
Memory IC TypeOTHER FIFO
memory width9
Number of functions1
Number of terminals28
word count512 words
character code512
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512X9
Output characteristics3-STATE
ExportableNO
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1
This Material Copyrighted By Its Respective Manufacturer

67C4501-35J Related Products

67C4501-35J 67C4501-35N 67C4501-50J 67C4501-50NL 67C4501-65J 67C4501-65N 67C4501-65NL 67C4501-80J 67C4501-80N 67C4501-80NL
Description FIFO, 512X9, 35ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 FIFO, 512X9, 35ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 FIFO, 512X9, 50ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 FIFO, 512X9, 50ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 512X9, 65ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 FIFO, 512X9, 65ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 FIFO, 512X9, 65ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 512X9, 80ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 FIFO, 512X9, 80ns, Asynchronous, CMOS, PDIP28, PLASTIC, DIP-28 FIFO, 512X9, 80ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD AMD AMD AMD AMD AMD AMD
Parts packaging code DIP DIP DIP QFJ DIP DIP QFJ DIP DIP QFJ
package instruction DIP, DIP28,.6 DIP, DIP28,.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 DIP, DIP28,.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6
Contacts 28 28 28 32 28 28 32 28 28 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 35 ns 35 ns 50 ns 50 ns 65 ns 65 ns 65 ns 80 ns 80 ns 80 ns
period time 45 ns 45 ns 65 ns 65 ns 80 ns 80 ns 80 ns 100 ns 100 ns 100 ns
JESD-30 code R-GDIP-T28 R-PDIP-T28 R-GDIP-T28 R-PQCC-J32 R-GDIP-T28 R-PDIP-T28 R-PQCC-J32 R-GDIP-T28 R-PDIP-T28 R-PQCC-J32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 37.1475 mm 37.084 mm 37.1475 mm 13.97 mm 37.1475 mm 37.084 mm 13.97 mm 37.1475 mm 37.084 mm 13.97 mm
memory density 4608 bit 4608 bit 4608 bit 4608 bit 4608 bit 4608 bit 4608 bit 4608 bit 4608 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9 9
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 28 28 28 32 28 28 32 28 28 32
word count 512 words 512 words 512 words 512 words 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512 512 512 512 512
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 512X9 512X9 512X9 512X9 512X9 512X9 512X9 512X9 512X9 512X9
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable NO NO NO NO NO NO NO NO NO NO
Package body material CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP QCCJ DIP DIP QCCJ DIP DIP QCCJ
Encapsulate equivalent code DIP28,.6 DIP28,.6 DIP28,.6 LDCC32,.5X.6 DIP28,.6 DIP28,.6 LDCC32,.5X.6 DIP28,.6 DIP28,.6 LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.588 mm 5.715 mm 5.588 mm 3.556 mm 5.588 mm 5.715 mm 3.556 mm 5.588 mm 5.715 mm 3.556 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES NO NO YES NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL QUAD DUAL DUAL QUAD DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 11.43 mm 15.24 mm 15.24 mm 11.43 mm 15.24 mm 15.24 mm 11.43 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1
Is Samacsys N - N N N N N N N N

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