SN74LS295BNP3 datasheet, PDF - EEWORLD Datasheet

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SN74LS295BNP3: DescriptionIC,SHIFT REGISTER,LS-TTL,DIP,14PIN,PLASTIC; Categorylogic Shift register; File Size199KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74LS295BNP3 Overview

IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,PLASTIC

SN74LS295BNP3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T14
Number of digits	4
Number of functions	1
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

SN74LS295BNP3 Related Products

	SN74LS295BNP3	SN74LS295BN3	SN74LS295BD3	SN74LS295BJ4	SN74LS295BJP4	SN74LS295BFN3
Description	IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,PLASTIC	IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,PLASTIC	IC,SHIFT REGISTER,LS-TTL,SOP,14PIN,PLASTIC	IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,CERAMIC	IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,CERAMIC	IC,SHIFT REGISTER,LS-TTL,LDCC,20PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3	DIP, DIP14,.3	QCCJ, LDCC20,.4SQ
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDIP-T14	R-PDIP-T14	R-PDSO-G14	R-XDIP-T14	R-XDIP-T14	S-PQCC-J20
Number of digits	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of terminals	14	14	14	14	14	20
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	DIP	DIP	QCCJ
Encapsulate equivalent code	DIP14,.3	DIP14,.3	SOP14,.25	DIP14,.3	DIP14,.3	LDCC20,.4SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	CHIP CARRIER
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD

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