IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-XDIP-T14 |
Number of digits | 4 |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
SN74LS295BJP4 | SN74LS295BN3 | SN74LS295BNP3 | SN74LS295BD3 | SN74LS295BJ4 | SN74LS295BFN3 | |
---|---|---|---|---|---|---|
Description | IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,PLASTIC | IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,PLASTIC | IC,SHIFT REGISTER,LS-TTL,SOP,14PIN,PLASTIC | IC,SHIFT REGISTER,LS-TTL,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,LS-TTL,LDCC,20PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
JESD-30 code | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-XDIP-T14 | S-PQCC-J20 |
Number of digits | 4 | 4 | 4 | 4 | 4 | 4 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 20 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | SOP | DIP | QCCJ |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | DIP14,.3 | LDCC20,.4SQ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES | NO | YES |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |