data sheet
fcCSP
Features:
LAMINATE
fcCSP
Packages:
Amkor Technology is now offering the Flip Chip CSP
(fcCSP) package — a flip chip solution in a CSP
package format. This package construction utilizes
eutectic tin/lead (63Sn/37Pb) flip chip interconnect
technology, in either area array or peripheral bump
layout, replacing standard wirebond interconnect. The
advantages of flip chip interconnect are twofold: it
provides enhanced electrical performance over
standard wirebond technology, and it allows for a
smaller form factor due to increased routing density,
the ability to use area array die bumps and the
elimination of wirebond loops. Current wafer bump
technology and flip chip assembly process allows for a
minimum of 150
µm
peripheral flip chip bumping, or
250
µm
area array bumping.
The
fcCSP
is based on Amkor's proprietary
ChipArray
®
BGA (CABGA) package construction,
using cutting edge thin core laminate substrates.
The package is assembled in strip format, gang
molded and saw singulated for manufacturing
efficiency and cost minimization. Laser ablated solder
mask technology, via-in-pad substrate structure, and
thin core substrate panel processing allow for
increased routing density and enhanced electrical
performance, making the
fcCSP
an attractive option
for advanced CSP applications where electrical
performance is a critical factor.
The
fcCSP
is available in both thin core laminate
substrate technology, as well as ceramic substrate
technology. Package size ranges from 3 mm to 15
mm, accommodating BGA ball pitches from 0.5 mm
to 1.0 mm. In addition to BGA technology, the
fcCSP
is also available in LGA format, allowing for a lower
minimum package thickness.
The Ceramic flip chip package provides maximum
flexibility for designers for number of layers and
routing. Current production is from 300 - 1800 I/O
in LGA, BGA or SCI (solder column interposer)
formats, 1.27 mm and 1.0 mm pitch. AlSiC lids
can be attached for maximum thermal dissipation.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
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Designed for high frequency applications
49 - 1800 ball counts
Target Market - Cell Phones, Hand-held Electronics
Thin core laminate or ceramic package construction
Overmolded for handling and second level reliability
Accommodates package sizes from 3 mm to 15 mm
Flip Chip bump pitches of 150
µ
m min. for
peripheral array, 250
µ
m min. for area array
Available in 0.5 mm - 1.0 mm BGA ball pitch,
as well as LGA interconnect
Minimum nominal package thickness of 0.80 mm for
LGA interconnect, 1.0 mm for 0.5 mm BGA pitch,
1.2 mm for 0.8 mm pitch
Turnkey Solution - Design, bumping, bumped wafer
probe, backgrind, assembly, test
Much better signal to noise ratio at higher
frequencies (>1Ghz)
Low inductance of flip chip bumps - short, direct
signal path
Flexible customized substrate routing
Thermal Performance:
Theta JA (°CW)
• 8 x 8 mm, 64 lead package with
1.75 mm x 2.27 mm die, 0.8 mm pitch,
0.6 mm mold cap
• 0 LFPM, 4 layer PC board
• Junction ambient thermal resistance = 48.1 °C/W
8 x 8 mm body, 64 ld, 0.8 mm ball pitch
Max
Min
0.26 nH
2.16 nH
Inductance
Capacitance
0.18 pF
0.38 pF
7 mΩ
53.9 mΩ
Resistance
Simulated results @ at 100 MHz
Electrical:
Reliability:
Package Level:
• Laminate Moisture
Sensitivity
• Ceramic Moisture
Sensitivity
• PCT
• Temp/Humidity
• High temp storage
• Temp cycle
Board Level:
• Thermal cycle
• Thermal cycle
JEDEC Level 3 @ 240 °C
30 °C/60% RH, 192 hours
JEDEC Level 1 @ 260 °C
85 °C/85% RH, 168 hours
121 °C/100% RH, 96 hours
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
-55 °C/+125 °C, 1000 cycles
-40 °C/+125 °C,
1 cycle/hour, 3000 cycles*
-40 °C/+125 °C,
2 cycles/hour, 2500 cycles*
*Data for 8 x 8 mm body, 64 lead, 0.33 mm PWB NSMD pad size
www.amkor.com
DS577D
Rev Date: 07’05
data sheet
fcCSP
fcBGA
(Flip Chip BGA):
Moderate routing density, lowest cost flip chip package in intermediate ball
counts. Bare die or Single Piece Lid. Qualified with both BU and 4L thin core
substrates. Ball Count range is 256 - 1900 and Body Size range is 17 - 45 mm.
Ceramic
fcBGA
(Ceramic Flip Chip BGA):
Alumina or HiTCE flip chip packages with BGA, LGA, or SCI interconnect format.
Capability for high layer count enables most flexible format for different ground
and power planes. Available in bare die, AISiC Lid, or low cost Flat Lid.
Qualified in body sizes ti 45 mm HiTCE (BGA), 45 mm alumina (SCI) and 31
mm alumina (BGA).
Applications:
The fcCSP package is targeted to high-performance workstations, servers, data
communication products, internet routers and at high frequency and RF
packaging applications where electrical performance is critical. The elimination of
wirebond loops allows for a low inductance connection to the die, while the
increased routing density enables optimized electrical paths for critical high
frequency signal lines. The fcCSP is also an attractive option for portable and
handheld electronics where, in addition to performance, package size is critical.
LAMINATE
Process Highlights
Die size (max)
Pkg size - 1 mm
Bump pitch (min)
Pkg size - 1 mm
In-line
150
µm
Minimum array
250
µm
Standard Materials
Package substrate
Hitachi FR5 E679 / BT
Bump
63/37 Sn/Pb
Encapsulant
Epoxy mold compound
Solder balls
Eutectic SnPb
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• -55 °C to +165 °C test available
• Burn-in
Shipping
JEDEC trays
Tape and reel services
Configuration Options:
Package Offering (units in mm)
Cross-section
fcCSP
Body Size
8x8
9x9
10 x 10
11 x 11
12 x 12
13 x 13
14 x 14
15 x 15
6x6
7x7
8x8
8x8
9x9
10 x 10
11 x 11
12 x 12
3x3
4x4
5x5
5x5
6x6
6x6
7x7
7x7
8x8
8x8
9x9
10 x 10
Pitch
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Ball Count
49
64
81
100
121
144
169
196
49
64
64
81
100
144
169
196
25
36
48
64
64
84
80
108
96
132
156
180
Matrix
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
2 Row
Full
2 Row
3 Row
2 Row
3 Row
2 Row
3 Row
3 Row
3 Row
Ceramic
fcBGA
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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