data sheet
Ceramic Small Outline
Integrated Circuit Package
(CSOIC)
This is a ceramic version of the Plastic SOIC
package. The CSOIC is a hermetic package
consisting of a multilayer ceramic surrounding a
"gullwing" formed leadframe. This package has
leads extending from two sides of the package
(dual). The package is hermetically solder sealed
at 325° Centigrade. These IC packages have
proven surface mount (SMT) performance
characteristics and have been designed to adapt
easily to ALL SMT processes and lines. Ceramic
SOIC packages provide component and packaging
engineers the ability and freedom to optimize
systems and product designs.
Applications:
End products range from consumer (audio, video,
and entertainment), telecom (pagers, cordless
telephone), RF/wireless (PC cards, RF/CATV,
telemetry), office (fax, copier, and printer),
PC/peripheral, automotive and other applications.
Whether you're working with resistor networks,
discrete semiconductors or ICs, CSOIC package
product lines will serve the needs of various
semiconductor technologies with ease.
Features:
CERAMIC
/
HERMETIC
CSOIC
The CSOIC offers a variety of features:
• 28 lead count (Others available if supplied
and tooled)
• 300 mil body size
• Hermetic solder sealed package
• High thermal conductive ceramic
• Gold lead finish
• "Gullwing" lead form
• JEDEC and EIAJ package outline standard
compliant
• Wide selection of cavity sizes to meet most
die size needs
• Commercial or full Military flows
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS807
Rev Date: 08’02
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
