Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP2-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | TSOP2 |
package instruction | TSOP2-32 |
Contacts | 32 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 12 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
length | 20.95 mm |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Encapsulate equivalent code | TSOP32,.46 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.01 A |
Minimum standby current | 3 V |
Maximum slew rate | 0.13 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3.15 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 10.16 mm |
Base Number Matches | 1 |