FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 50 ns |
Other features | RETRANSMIT |
period time | 65 ns |
JESD-30 code | R-PDIP-T28 |
length | 37.084 mm |
memory density | 9216 bit |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX9 |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 5.715 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 15.24 mm |
Base Number Matches | 1 |
AM7202A-50PC | AM7202A-15JC | AM7202A-15RC | AM7202A-25PC | AM7202A-25RC | AM7202A-35RC | AM7202A-50JC | AM7202A-50RC | AM7202A-35JC | |
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Description | FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FIFO, 1KX9, 15ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 1KX9, 15ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 1KX9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 1KX9, 50ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 | FIFO, 1KX9, 50ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | FIFO, 1KX9, 35ns, Asynchronous, CMOS, PQCC32, PLASTIC, LCC-32 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Parts packaging code | DIP | QFJ | DIP | DIP | DIP | DIP | QFJ | DIP | QFJ |
package instruction | DIP, | QCCJ, | DIP, | DIP, | DIP, | DIP, | QCCJ, | DIP, | QCCJ, |
Contacts | 28 | 32 | 28 | 28 | 28 | 28 | 32 | 28 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 50 ns | 15 ns | 15 ns | 25 ns | 25 ns | 35 ns | 50 ns | 50 ns | 35 ns |
Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
period time | 65 ns | 25 ns | 25 ns | 35 ns | 35 ns | 45 ns | 65 ns | 65 ns | 45 ns |
JESD-30 code | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 |
length | 37.084 mm | 13.97 mm | 35.2425 mm | 37.084 mm | 35.2425 mm | 35.2425 mm | 13.97 mm | 35.2425 mm | 13.97 mm |
memory density | 9216 bit | 9216 bit | 9216 bit | 9216 bit | 9216 bit | 9216 bit | 9216 bit | 9216 bit | 9216 bit |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 32 | 28 | 28 | 28 | 28 | 32 | 28 | 32 |
word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 | 1KX9 |
Exportable | NO | NO | NO | NO | NO | NO | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | QCCJ | DIP | DIP | DIP | DIP | QCCJ | DIP | QCCJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.715 mm | 3.556 mm | 5.08 mm | 5.715 mm | 5.08 mm | 5.08 mm | 3.556 mm | 5.08 mm | 3.556 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | NO | NO | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 15.24 mm | 11.43 mm | 7.62 mm | 15.24 mm | 7.62 mm | 7.62 mm | 11.43 mm | 7.62 mm | 11.43 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |