DATA SHEET
MOS FIELD EFFECT TRANSISTOR
2SK3435
SWITCHING
N-CHANNEL POWER MOS FET
DESCRIPTION
The 2SK3435 is N-channel MOS Field Effect Transistor
designed for high current switching applications.
ORDERING INFORMATION
PART NUMBER
2SK3435
2SK3435-S
PACKAGE
TO-220AB
TO-262
TO-263
TO-220SMD
Note
FEATURES
•
Super low on-state resistance
R
DS(on)1
= 14 mΩ MAX. (V
GS
= 10 V, I
D
= 40 A)
R
DS(on)2
= 22 mΩ MAX. (V
GS
= 4.0 V, I
D
= 40 A)
•
Low C
iss
: C
iss
= 3200 pF TYP.
•
Built-in gate protection diode
2SK3435-ZJ
2SK3435-Z
Note
TO-220SMD package is produced only
in Japan.
(TO-220AB)
ABSOLUTE MAXIMUM RATINGS (T
A
= 25°C)
Drain to Source Voltage (V
GS
= 0 V)
Gate to Source Voltage (V
DS
= 0 V)
Drain Current (DC) (T
C
= 25°C)
Drain Current (pulse)
Note1
V
DSS
V
GSS
I
D(DC)
I
D(pulse)
P
T
P
T
T
ch
T
stg
60
±20
±80
±160
84
1.5
150
−55
to +150
31
96
V
V
A
A
W
W
°C
°C
A
mJ
(TO-262)
Total Power Dissipation (T
C
= 25°C)
Total Power Dissipation (T
A
= 25°C)
Channel Temperature
Storage Temperature
Single Avalanche Current
Single Avalanche Energy
Note2
Note2
I
AS
E
AS
Notes 1.
PW
≤
10
µ
s, Duty cycle
≤
1%
2.
Starting T
ch
= 25°C, V
DD
= 30 V, R
G
= 25
Ω,
V
GS
= 20
→
0 V
(TO-220SMD)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
D14604EJ3V0DS00 (3rd edition)
Date Published July 2002 NS CP(K)
Printed in Japan
The mark
5
shows major revised points.
©
1999, 2001
2SK3435
ELECTRICAL CHARACTERISTICS (T
A
= 25°C)
CHARACTERISTICS
Zero gate Voltage Drain Current
Gate Leakage Current
Gate Cut-off Voltage
Forward Transfer Admittance
Drain to Source On-state Resistance
SYMBOL
I
DSS
I
GSS
V
GS(off)
| y
fs
|
R
DS(on)1
R
DS(on)2
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Total Gate Charge
Gate to Source Charge
Gate to Drain Charge
Body Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
G
Q
GS
Q
GD
V
F(S-D)
t
rr
Q
rr
V
DD
= 48 V
V
GS
= 10 V
I
D
= 80 A
I
F
= 80 A, V
GS
= 0 V
I
F
= 80 A, V
GS
= 0 V
di/dt = 100 A/
µ
s
TEST CONDITIONS
V
DS
= 60 V, V
GS
= 0 V
V
GS
= ±20 V, V
DS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
V
DS
= 10 V, I
D
= 40 A
V
GS
= 10 V, I
D
= 40 A
V
GS
= 4.0 V, I
D
= 40 A
V
DS
= 10 V
V
GS
= 0 V
f = 1 MHz
V
DD
= 30 V, I
D
= 40 A
V
GS
= 10 V
R
G
= 10
Ω
1.5
21
2.0
43
11
16
3200
520
260
80
1200
200
350
60
10
16
1.0
46
66
14
22
MIN.
TYP.
MAX.
10
±10
2.5
UNIT
µ
A
µ
A
V
S
mΩ
mΩ
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
V
ns
nC
TEST CIRCUIT 1 AVALANCHE CAPABILITY
D.U.T.
R
G
= 25
Ω
PG.
V
GS
= 20
→
0 V
BV
DSS
V
DS
V
GS
0
50
Ω
L
V
DD
TEST CIRCUIT 2 SWITCHING TIME
D.U.T.
R
L
PG.
R
G
V
DD
I
D
90%
90%
V
GS
V
GS
Wave Form
0
10%
V
GS
90%
I
AS
I
D
V
DD
I
D
I
D
Wave Form
0 10%
10%
τ
τ
= 1
µ
s
Duty Cycle
≤
1%
t
d(on)
t
on
t
r
t
d(off)
t
off
t
f
Starting T
ch
TEST CIRCUIT 3 GATE CHARGE
D.U.T.
I
G
= 2 mA
50
Ω
R
L
V
DD
PG.
2
Data Sheet D14604EJ3V0DS
2SK3435
TYPICAL CHARACTERISTICS (T
A
= 25°C )
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
TOTAL POWER DISSIPATION vs.
CASE TEMPERATURE
140
dT - Percentage of Rated Power - %
P
T
- Total Power Dissipation - W
100
80
60
40
20
0
120
100
80
60
40
20
0
0
20
40
60
80
100
120 140
160
0
20
40
60
80
100
120 140
160
T
ch
- Channel Temperature -
˚C
T
C
- Case Temperature - ˚C
FORWARD BIAS SAFE OPERATING AREA
1000
I
D(pulse)
I
D
- Drain Current - A
100
R
D
t V
G
(a
S
d
ite )
im 0 V
I
D(DC)
)
L
n
(o
=1
S
PW
10
0
µ
s
=1
0
µ
s
10
10
Po
ms
D
Lim wer D
C
ite
d issipa
tio
n
1m
s
1
T
C
= 25˚C
Single Pulse
1
10
100
V
DS
- Drain to Source Voltage - V
0.1
0.1
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
r
th(t)
- Transient Thermal Resistance - ˚C/W
100
R
th(ch-A)
= 83.3˚C/W
10
1
R
th(ch-C)
= 1.49˚C/W
0.1
0.01
10
µ
Single Pulse
100
µ
1m
10 m
100 m
1
10
100
1000
PW - Pulse Width - s
Data Sheet D14604EJ3V0DS
3
2SK3435
FORWARD TRANSFER CHARACTERISTICS
1000 Pulsed
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
100
I
D
- Drain Current - A
10
T
A
= –40˚C
25˚C
75˚C
150˚C
I
D
- Drain Current - A
100
80
60
V
GS
=10 V
40
4.0 V
20
0
0
0.2
0.4
0.6
Pulsed
0.8
1
0.1
1
2
3
4
V
DS
= 10 V
5
6
V
GS
- Gate to Source Voltage - V
V
DS
- Drain to Source Voltage - V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
| y
fs
| - Forward Transfer Admittance - S
R
DS(on)
- Drain to Source On-state Resistance - mΩ
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
50
Pulsed
40
100 V
DS
= 10 V
Pulsed
10
30
1
T
A
= 150˚C
75˚C
25˚C
–40˚C
20
I
D
= 40 A
10
0.1
0.01
0.01
0
0.1
1
10
100
0
5
10
15
20
I
D
- Drain Current - A
V
GS
- Gate to Source Voltage - V
R
DS(on)
- Drain to Source On-state Resistance - mΩ
40
Pulsed
30
V
GS(off)
- Gate to Source Threshold Voltage - V
DRAIN TO SOURCE ON-STATE
RESISTANCE vs. DRAIN CURRENT
GATE TO SOURCE THRESHOLD VOLTAGE vs.
CHANNEL TEMPERATURE
3.0
V
DS
= 10 V
I
D
= 1 mA
2.5
2.0
1.5
1.0
0.5
0
−50
20
V
GS
= 4.0 V
10
10 V
0
1
10
100
1000
0
50
100
150
I
D
- Drain Current - A
T
ch
- Channel Temperature - ˚C
4
Data Sheet D14604EJ3V0DS
2SK3435
R
DS(on)
- Drain to Source On-state Resistance - mΩ
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
40
Pulsed
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
1000
Pulsed
30
I
SD
- Diode Forward Current - A
V
GS
= 4.0 V
10 V
100
V
GS
= 10 V
20
10
V
GS
= 0 V
10
1
0
I
D
= 40 A
−50
0
50
100
150
0.1
0
0.5
1.0
1.5
T
ch
- Channel Temperature - ˚C
V
SD
- Source to Drain Voltage - V
CAPACITANCE vs. DRAIN TO
SOURCE VOLTAGE
10000
SWITCHING CHARACTERISTICS
10000
C
iss
, C
oss
, C
rss
- Capacitance - pF
t
d(on)
, t
r
, t
d(off)
, t
f
- Switching Time - ns
V
GS
= 0 V
f = 1 MHz
C
iss
V
DD
= 30 V
R
G
= 10
Ω
V
GS
= 10 V
t
r
1000
C
oss
100
1000
t
d(off)
100
t
d(on)
10
0.1
t
f
C
rss
10
0.1
1
10
100
1
10
100
V
DS
- Drain to Source Voltage - V
I
D
- Drain Current - A
REVERSE RECOVERY TIME vs.
DRAIN CURRENT
1000
DYNAMIC INPUT/OUTPUT CHARACTERISTICS
80
16
14
12
V
DD
= 48 V
30 V
12 V
V
GS
10
8
6
4
V
DS
10
20
30
40
50
60
70
80
2
t
rr
- Reverse Recovery Time - ns
V
DS
- Drain to Source Voltage - V
70
60
50
40
30
20
10
0
0
100
10
1
0.1
1
10
100
I
F
- Drain Current - A
Q
G
- Gate Charge - nC
Data Sheet D14604EJ3V0DS
V
GS
- Gate to Source Voltage - V
di/dt = 100 A/
µ
s
V
GS
= 0 V
5