DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | TFBGA, BGA96,9X16,32 |
| Contacts | 96 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | MULTI BANK PAGE BURST |
| Maximum access time | 0.225 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 800 MHz |
| I/O type | COMMON |
| interleaved burst length | 8 |
| JESD-30 code | R-PBGA-B96 |
| length | 13.3 mm |
| memory density | 2147483648 bit |
| Memory IC Type | DDR DRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 96 |
| word count | 134217728 words |
| character code | 128000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | |
| organize | 128MX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Encapsulate equivalent code | BGA96,9X16,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 1.5 V |
| Certification status | Not Qualified |
| refresh cycle | 8192 |
| Maximum seat height | 1.2 mm |
| self refresh | YES |
| Continuous burst length | 8 |
| Maximum standby current | 0.011 A |
| Maximum slew rate | 0.219 mA |
| Maximum supply voltage (Vsup) | 1.575 V |
| Minimum supply voltage (Vsup) | 1.425 V |
| Nominal supply voltage (Vsup) | 1.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.5 mm |
| Base Number Matches | 1 |
| K4B2G1646Q-BCK0 | K4B2G1646Q-BCK00 | K4B2G1646Q-BCNB0 | K4B2G1646Q-BCH90 | K4B2G1646Q-BIH90 | |
|---|---|---|---|---|---|
| Description | DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 | DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 | DDR DRAM, 128MX16, 0.18ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 | DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 | DDR DRAM, 128MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | BGA | BGA | BGA | BGA | BGA |
| package instruction | TFBGA, BGA96,9X16,32 | TFBGA, BGA96,9X16,32 | TFBGA, BGA96,9X16,32 | TFBGA, BGA96,9X16,32 | TFBGA, BGA96,9X16,32 |
| Contacts | 96 | 96 | 96 | 96 | 96 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
| Maximum access time | 0.225 ns | 0.225 ns | 0.18 ns | 0.255 ns | 0.255 ns |
| Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 800 MHz | 800 MHz | 1066 MHz | 667 MHz | 667 MHz |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| interleaved burst length | 8 | 8 | 8 | 8 | 8 |
| JESD-30 code | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 |
| length | 13.3 mm | 13.3 mm | 13.3 mm | 13.3 mm | 13.3 mm |
| memory density | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit |
| Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
| memory width | 16 | 16 | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 96 | 96 | 96 | 96 | 96 |
| word count | 134217728 words | 134217728 words | 134217728 words | 134217728 words | 134217728 words |
| character code | 128000000 | 128000000 | 128000000 | 128000000 | 128000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| organize | 128MX16 | 128MX16 | 128MX16 | 128MX16 | 128MX16 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA |
| Encapsulate equivalent code | BGA96,9X16,32 | BGA96,9X16,32 | BGA96,9X16,32 | BGA96,9X16,32 | BGA96,9X16,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 8192 | 8192 | 8192 | 8192 | 8192 |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| self refresh | YES | YES | YES | YES | YES |
| Continuous burst length | 8 | 8 | 8 | 8 | 8 |
| Maximum standby current | 0.011 A | 0.011 A | 0.012 A | 0.011 A | 0.011 A |
| Maximum slew rate | 0.219 mA | 0.219 mA | 0.245 mA | 0.193 mA | 0.193 mA |
| Maximum supply voltage (Vsup) | 1.575 V | 1.575 V | 1.575 V | 1.575 V | 1.575 V |
| Minimum supply voltage (Vsup) | 1.425 V | 1.425 V | 1.425 V | 1.425 V | 1.425 V |
| Nominal supply voltage (Vsup) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | OTHER | OTHER | OTHER | OTHER | INDUSTRIAL |
| Terminal form | BALL | BALL | BALL | BALL | BALL |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm |
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