z-QUAD SMALL FORM-FACTOR
PLUGGABLE PLUS (zQSFP+ OR
QSFP28/56) INTERCONNECT SYSTEM
Quick Reference Guide
te.com/products/QSFP
DATA AND DEVICES
/// zQSFP+ (QSFP28/56) INTERCONNECTS
zQSFP+ (QSFP28/56) Interconnects
Introducing zQSFP+ Interconnect System
TE Connectivity’s (TE) zQSFP+ interconnects offer an increased data rate of 28 Gbps NRZ and 56 Gbps PAM-4 in an industry
standard, scalable design that allows for backwards compatibility with QSFP+ cables and transceivers, providing a simple
upgrade path from 10 Gbps to 28 Gbps and 56 Gbps. The complete portfolio of interconnects deliver a large range of simple and
customizable design options to meet most customer requirements.
Features and Benefits
Increased Data Rates
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Data transfer rates of 28 Gbps NRZ and 56 Gbps PAM-4
Supports Ethernet and InfiniBand (IB) Enhanced Data Rate (EDR) requirements
Supports single channel, dual channel and quad channel implementations
Industry Standard and Customizable Design
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Industry standard interface
Backwards compatible with QSFP+ cables and transceivers
Improved loss budget for optics and copper cables at 10 Gbps
Comprehensive Portfolio and Inventory
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Dual sourced product available through Molex, LLC.
Features behind and through bezel cages with various lightpipe and heat sink options
Well-stocked distribution channel
Improved EMI Performance
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Increased data rates make EMI protection more challenging
Provide excellent EMI protection through 56 Gbps
Applications
Product Applications
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Network Interface
Switches
Servers
Routers
Wireless Base Stations
Test and Measurement Equipment
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Applications by Protocol
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50, 100 and 200 Gigabit Ethernet
100 Gbps InfiniBand (IB) Enhanced Data Rate
(EDR) requirements
128G Fibre Channel
25G/50G Consortium
25G NRZ and 56G PAM-4
DATA AND DEVICES
/// zQSFP+ (QSFP28/56) INTERCONNECTS
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zQSFP+ (QSFP28/56) Interconnects
Enhanced zQSFP+ (QSFP28/56) Cages
EMI Enhanced
Thermally Enhanced
External riding heatsink
High-performance springs
are both flexible and strong
Improved springs
more fully seal
connector from EMI
Internal riding
heatsink
Reference base part number 2170709 on page 7
Reference base part numbers 2299940, 2299870,
2299924, 2321666 and 2321630 on page 7
Air vent
holes
Lower Assembly
Insertion Force
Help increase assembly
throughput by providing
a 55% reduction in force
needed to insert the line
card into the front bezel.
The reduction in insertion
force makes assembly
easier, faster, and reduces
the risk for damage which
can lead to reduced EMI
performance.
Improved EMI
Performance
EMI sealing
enhancements on
these new cages
provide 10 dB
EMI performance
improvement over
current QSFP28
products.
Lower Port Cooling
Internal riding heatsink
in the seperator
plate area provides
enhanced cooling to
the lower ports and a
12-15
o
C improvement
over standard stacked
zQSFP+ cages.
Optimized Airflow
External riding heatsinks
on the upper port are
optimized for airflow
direction (also available
without heatsinks).
Air vent holes allow for air
to pass through and exit
out the sides and rear of the
cage.
Intel Omni-Path Architecture
Stacked Belly-to-Belly
Image source: Intel
Image source: Intel
Reference part numbers 2227670-7, 2300281-1,
2170704-1 and 1551920-2 on page 7
Reference base part numbers 2314790, 2308171 and
2315050 on page 7
Designed for Intel Omni-Path Architecture
These zQSFP+ 2x2 and 1x2 cages are specifically
designed for Intel Omni-Path Architecture
(OPA) switch architectures, and 1x1 zQSFP+
cages for OPA NIC cards. Designing with these
cages allows access to proven technology to
support high performance applications.
High Density
Certain stacked cages can
be used in belly-to-belly
applications to support high
density 2RU+ box designs and
switch designs using next-gen
48 and 64 silicon ports.
Low Cost
Using a stacked belly-to-
belly design enables single
PCB architecture versus two
PCBs per line card, saving
significant system costs.
DATA AND DEVICES
/// zQSFP+ (QSFP28/56) INTERCONNECTS
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zQSFP+ (QSFP28/56) Interconnects
1xN Mechanical Options
Bezel Mount
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Behind bezel cages use a gasket applied by the
customer to the cage or bezel sheet metal
EMI spring versions and gasket versions share
the same PCB footprint and bezel cutout
TE offers low insertion force EMI springs to assist
in assembly of high density products
Through Bezel with EMI
Springs
Through Bezel with EMI
Gasket
Behind Bezel (customer
applies gasket)
Lightpipe Options
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Single
Dual
TE offers 1, 2 or 4 lightpipe options per port
Standard lightpipes are designed to support up to 1.00mm
height 0805 style LEDs
Lightpipes are shipped with an organizer to prevent optical
cross-talk
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Quad
Heat Sink Styles
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TE offers SAN, LAN and Networking height
heatsinks
Custom heatsinks are available upon
request
Height is max height of assembly from
surface of PCB
PCI (13.7mm height)
SAN (16.0mm height)
NET (23.0mm height)
Rear EONs
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Rear pins are used to improve EMI grounding and
cage retention to the PCB
TE offers all styles outlined in the SFF-8662
footprint
2 rear EONs
1 rear EONs
0 rear EON’s
Rear EONs will be dependent upon the
customer’s routing preference and technical
specifications
DATA AND DEVICES
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zQSFP+ (QSFP28/56) Interconnects
2xN Mechanical Options
Bezel Mount
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Through bezel assemblies with EMI
springs or EMI gaskets are available
Custom gasketing options are available
upon request
Through Bezel with EMI Springs
Through Bezel with EMI Gasket
Lightpipe Options
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TE offers zero, single and dual lightpipe options per port
For higher lightpipe counts, the customer may add
lightpipes underneath their PCB to indicate lower port
activity
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The thermal footprint design offers 4x lightpipes assem-
bled above the cage
Single (per port)
Dual (per port)
Lightpipes are designed to support up to 0.80mm height
0805 style LEDs
Rear EONs
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Rear pins are used to improve EMI grounding and
cage retention to the PCB
TE offers zero or three rear pins per port column
Rear EONs will be dependent upon the
customer’s routing preference and technical
specifications
3 rear EONs
0 rear EONs
DATA AND DEVICES
/// zQSFP+ (QSFP28/56) INTERCONNECTS
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