W3H264M16E-400B2C datasheet, PDF

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W3H264M16E-400B2C: DescriptionDDR DRAM, 128MX16, 0.8ns, CMOS, PBGA79, BGA-79; Categorystorage storage; ManufacturerMercury Systems Inc

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W3H264M16E-400B2C Overview

DDR DRAM, 128MX16, 0.8ns, CMOS, PBGA79, BGA-79

W3H264M16E-400B2C Parametric

Parameter Name	Attribute value
Maker	Mercury Systems Inc
package instruction	BGA,
Reach Compliance Code	compliant
access mode	DUAL BANK PAGE BURST
Maximum access time	0.8 ns
Other features	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 code	R-PBGA-B79
length	14.1 mm
memory density	2147483648 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	79
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Maximum seat height	2.42 mm
self refresh	YES
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	11.1 mm
Base Number Matches	1

W3H264M16E-400B2C Related Products

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Description	DDR DRAM, 128MX16, 0.8ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.8ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.65ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.65ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.65ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.65ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.65ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.8ns, CMOS, PBGA79, BGA-79	DDR DRAM, 128MX16, 0.65ns, CMOS, PBGA79, BGA-79
Maker	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc	Mercury Systems Inc
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	0.8 ns	0.8 ns	0.65 ns	0.65 ns	0.65 ns	0.65 ns	0.65 ns	0.8 ns	0.65 ns
Other features	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED	AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 code	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79	R-PBGA-B79
length	14.1 mm	14.1 mm	14.1 mm	14.1 mm	14.1 mm	14.1 mm	14.1 mm	14.1 mm	14.1 mm
memory density	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	79	79	79	79	79	79	79	79	79
word count	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000	128000000	128000000	128000000	128000000	128000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	125 °C	85 °C	85 °C	70 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-	-40 °C	-55 °C	-40 °C	-40 °C	-	-	-55 °C	-55 °C
organize	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16	128MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Maximum seat height	2.42 mm	2.42 mm	2.42 mm	2.42 mm	2.42 mm	2.42 mm	2.42 mm	2.42 mm	2.42 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	11.1 mm	11.1 mm	11.1 mm	11.1 mm	11.1 mm	11.1 mm	11.1 mm	11.1 mm	11.1 mm
Base Number Matches	1	1	1	1	1	1	1	-	-

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