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EPCS1

Description
4M X 1 CONFIGURATION MEMORY, PDSO8
Categorystorage   
File Size226KB,32 Pages
ManufacturerAltera (Intel)
Download Datasheet Parametric Compare View All

EPCS1 Overview

4M X 1 CONFIGURATION MEMORY, PDSO8

EPCS1 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals8
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
maximum clock frequency20 MHz
Processing package descriptionLead FREE, plastic, SOIC-8
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
packaging shapeRectangle
Package SizeSMALL OUTLINE
surface mountYes
Terminal formGULL WING
Terminal spacing1.27 mm
terminal coatingNickel(39) Palladium(2) Gold
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
memory width1
organize4M × 1
storage density4.19E6 deg
operating modeSynchronize
Number of digits4.19E6 words
Number of digits4M
Memory IC typeconfiguration memory
serial parallelserial
Chapter 4. Serial Configuration
Devices (EPCS1, EPCS4,
EPCS16 & EPCS64) Data Sheet
C51014-2.0
Features
The serial configuration devices provide the following features:
1-, 4-, 16-, and 64-Mbit flash memory devices that serially configure
Stratix
®
II FPGAs and the Cyclone™ series FPGAs using the active
serial (AS) configuration scheme
Easy-to-use four-pin interface
Low cost, low pin count and non-volatile memory
Low current during configuration and near-zero standby mode
current
3.3-V operation
Available in 8-pin and 16-pin small outline integrated circuit (SOIC)
package
Enables the Nios
®
processor to access unused flash memory through
AS memory interface
Re-programmable memory with more than 100,000 erase/program
cycles
Write protection support for memory sectors using status register
bits
In-system programming support with SRunner software driver
Programming support with USB Blaster™ or ByteBlaster™ II
download cables
Additional programming support with the Altera
®
Programming
Unit (APU) and programming hardware from BP Microsystems,
System General, and other vendors
Software design support with the Altera Quartus
®
II development
system for Windows-based PCs as well as Sun SPARC station and
HP 9000 Series 700/800
Delivered with the memory array erased (all the bits set to
1)
Whenever the term “serial configuration device(s)” is used in
this document, it refers to Altera EPCS1, EPCS4, EPCS16, and
EPCS64 devices.
1
Functional
Description
With SRAM-based devices such as Stratix II FPGAs and the Cyclone
series FPGAs, configuration data must be reloaded each time the device
powers up, the system initializes, or when new configuration data is
needed. Serial configuration devices are flash memory devices with a
Altera Corporation
July 2004
Core Version a.b.c variable
4–1
Preliminary

EPCS1 Related Products

EPCS1 EPCS16 EPCS4 EPCS64 EPCS4SI8N
Description 4M X 1 CONFIGURATION MEMORY, PDSO8 4M X 1 CONFIGURATION MEMORY, PDSO8 4M X 1 CONFIGURATION MEMORY, PDSO8 4M X 1 CONFIGURATION MEMORY, PDSO8 4M X 1 CONFIGURATION MEMORY, PDSO8
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 Cel 85 Cel 85 Cel 85 Cel 85 °C
Minimum operating temperature -40 Cel -40 Cel -40 Cel -40 Cel -40 °C
surface mount Yes Yes Yes Yes YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location pair pair pair pair DUAL
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 1 1 1 1 1
organize 4M × 1 4M × 1 4M × 1 4M × 1 4MX1
Maximum supply/operating voltage 3.6 V 3.6 V 3.6 V 3.6 V -
Minimum supply/operating voltage 3 V 3 V 3 V 3 V -
Rated supply voltage 3.3 V 3.3 V 3.3 V 3.3 V -
maximum clock frequency 20 MHz 20 MHz 20 MHz 20 MHz -
Processing package description Lead FREE, plastic, SOIC-8 Lead FREE, plastic, SOIC-8 Lead FREE, plastic, SOIC-8 Lead FREE, plastic, SOIC-8 -
Lead-free Yes Yes Yes Yes -
EU RoHS regulations Yes Yes Yes Yes -
China RoHS regulations Yes Yes Yes Yes -
state ACTIVE ACTIVE ACTIVE ACTIVE -
packaging shape Rectangle Rectangle Rectangle Rectangle -
Package Size SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE -
Terminal spacing 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
terminal coating Nickel(39) Palladium(2) Gold Nickel(39) Palladium(2) Gold Nickel(39) Palladium(2) Gold Nickel(39) Palladium(2) Gold -
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy -
storage density 4.19E6 deg 4.19E6 deg 4.19E6 deg 4.19E6 deg -
operating mode Synchronize Synchronize Synchronize Synchronize -
Number of digits 4M 4M 4M 4M -
Memory IC type configuration memory configuration memory configuration memory configuration memory -
serial parallel serial serial serial serial -
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