MC14490DWR2 datasheet, PDF - EEWORLD Datasheet

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MC14490DWR2: DescriptionSpecialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR; Categorylogic logic; File Size162KB，11 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn

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MC14490DWR2 Overview

Specialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR

MC14490DWR2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ON Semiconductor
Parts packaging code	SOIC
package instruction	SOIC-16
Contacts	16
Reach Compliance Code	not_compliant
Counting direction	RIGHT
series	4000/14000/40000
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
length	10.3 mm
Logic integrated circuit type	LOGIC CIRCUIT
Humidity sensitivity level	1
Number of digits	4
Number of functions	6
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	240
power supply	5/15 V
propagation delay (tpd)	740 ns
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	7.5 mm
minfmax	4.5 MHz
Base Number Matches	1

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MC14490

Hex Contact Bounce

Eliminator

The MC14490 is constructed with complementary MOS enhancement

mode devices, and is used for the elimination of extraneous level changes

that result when interfacing with mechanical contacts. The digital contact

bounce eliminator circuit takes an input signal from a bouncing contact

and generates a clean digital signal four clock periods after the input has

stabilized. The bounce eliminator circuit will remove bounce on both the

“make” and the “break” of a contact closure. The clock for operation of

the MC14490 is derived from an internal R−C oscillator which requires

only an external capacitor to adjust for the desired operating frequency

(bounce delay). The clock may also be driven from an external clock

source or the oscillator of another MC14490 (see Figure 5).

NOTE: Immediately after powerup, the outputs of the MC14490 are in

indeterminate states.

Features

http://onsemi.com

MARKING

DIAGRAMS

PDIP−16

P SUFFIX

CASE 648

SOIC−16

DW SUFFIX

CASE 751G

SOEIAJ−16

F SUFFIX

CASE 966

WL, L

YY, Y

WW, W

MC14490

ALYWG

MC14490P

AWLYYWWG

14490

AWLYYWWG

•

Diode Protection on All Inputs

Six Debouncers Per Package

Internal Pullups on All Data Inputs

Can Be Used as a Digital Integrator, System Synchronizer, or Delay Line

Internal Oscillator (R−C), or External Clock Source

TTL Compatible Data Inputs/Outputs

Single Line Input, Debounces Both “Make” and “Break” Contacts

Does Not Require “Form C” (Single Pole Double Throw) Input Signal

Cascadable for Longer Time Delays

Schmitt Trigger on Clock Input (Pin 7)

Supply Voltage Range = 3.0 V to 18 V

Chip Complexity: 546 FETs or 136.5 Equivalent Gates

These Devices are Pb−Free and are RoHS Compliant

NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

Parameter

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 9 of this data sheet.

MAXIMUM RATINGS

(Voltages Referenced to V

)

Symbol

, V

out

stg

Value

−0.5

to +18.0

−0.5

to V

+ 0.5

500

−55

to +125

−65

to +150

260

Unit

°C

DC Supply Voltage Range

Input or Output Voltage Range

(DC or Transient)

Input Current (DC or Transient) per Pin

Power Dissipation, per Package (Note 1)

Ambient Temperature Range

Storage Temperature Range

Lead Temperature (8−Second Soldering)

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be

taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, V

and V

out

should be constrained to the range V

or V

out

)

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V

or V

). Unused outputs must be left open.

Semiconductor Components Industries, LLC, 2013

May, 2013

−

Rev. 10

Publication Order Number:

MC14490/D

MC14490DWR2 Related Products

	MC14490DWR2	MC14490P	MC14490PG	MC14490F	MC14490DW
Description	Specialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR	Specialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR	Specialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR	Specialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR	Specialty Function Logic LOG CMOS 3-18V HEX BOUNCE ELIMINATOR
Is it Rohs certified?	incompatible	incompatible	conform to	conform to	incompatible
Maker	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor
Parts packaging code	SOIC	DIP	DIP	SOIC	SOIC
package instruction	SOIC-16	DIP-16	DIP-16	SOP-16	SOIC-16
Contacts	16	16	16	16	16
Reach Compliance Code	not_compliant	not_compliant	unknown	unknown	not_compliant
Counting direction	RIGHT	RIGHT	RIGHT	RIGHT	RIGHT
series	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000	4000/14000/40000
JESD-30 code	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0	e3	e4	e0
length	10.3 mm	19.175 mm	19.175 mm	10.2 mm	10.3 mm
Logic integrated circuit type	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT
Number of digits	4	4	4	4	4
Number of functions	6	6	6	6	6
Number of terminals	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	SOP	SOP
Encapsulate equivalent code	SOP16,.4	DIP16,.3	DIP16,.3	SOP16,.3	SOP16,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	240	235	260	260	240
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
propagation delay (tpd)	740 ns	740 ns	740 ns	740 ns	740 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	4.44 mm	4.44 mm	2.05 mm	2.65 mm
Maximum supply voltage (Vsup)	18 V	18 V	18 V	18 V	18 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Nickel/Palladium/Gold (Ni/Pd/Au)	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	40	40	30
width	7.5 mm	7.62 mm	7.62 mm	5.275 mm	7.5 mm
minfmax	4.5 MHz	4.5 MHz	4.5 MHz	4.5 MHz	4.5 MHz

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