Video Switch ICs SPDT Wideband T-Sw
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Maker | Vishay |
Parts packaging code | SOIC |
package instruction | SOP, SOP16,.25 |
Contacts | 16 |
Reach Compliance Code | unknown |
Other features | VIDEO APPLICATION |
Analog Integrated Circuits - Other Types | AUDIO/VIDEO SWITCH |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e0 |
length | 9.9 mm |
Nominal Negative Supply Voltage (Vsup) | -3 V |
normal position | NO/NC |
Number of channels | 1 |
Number of functions | 2 |
Number of terminals | 16 |
Nominal off-state isolation | 75 dB |
On-state resistance matching specifications | 2 Ω |
Maximum on-state resistance (Ron) | 60 Ω |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
output | SEPARATE OUTPUT |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP16,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 15,-3 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Nominal supply voltage (Vsup) | 15 V |
surface mount | YES |
Maximum disconnect time | 60 ns |
Maximum connection time | 100 ns |
switch | BREAK-BEFORE-MAKE |
technology | NMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 3.9 mm |
DG542DY-T1 | DG542AP | DG541DJ-E3 | DG541DJ | DG540DN-E3 | DG540AP | DG541DY-T1-E3 | DG540DJ | DG542DJ | DG542DY-E3 | |
---|---|---|---|---|---|---|---|---|---|---|
Description | Video Switch ICs SPDT Wideband T-Sw | Video Switch ICs SPDT Wideband T-Sw | Video Switch ICs SPST Wideband T-Sw | Video Switch ICs SPST Wideband T-Sw | Video Switch ICs SPST Wideband T-Sw | Video Switch ICs SPST Wideband T-Sw | Video Switch ICs SPST Wideband T-Sw | Video Switch ICs SPST Wideband T-Sw | Video Switch ICs SPDT Wideband T-Sw | Video Switch ICs SPDT Wideband T-Sw |
Is it lead-free? | Contains lead | Contains lead | Lead free | Contains lead | Lead free | Contains lead | Lead free | Contains lead | Contains lead | Lead free |
Maker | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay | Vishay |
Parts packaging code | SOIC | DIP | DIP | DIP | QLCC | DIP | SOIC | DIP | DIP | SOIC |
package instruction | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | SOP, SOP16,.25 | DIP, DIP20,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 |
Contacts | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 20 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Analog Integrated Circuits - Other Types | AUDIO/VIDEO SWITCH | SPST | AUDIO/VIDEO SWITCH | SPST | AUDIO/VIDEO SWITCH | SPST | AUDIO/VIDEO SWITCH | SPST | SPST | AUDIO/VIDEO SWITCH |
JESD-30 code | R-PDSO-G16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | S-PQCC-J20 | R-XDIP-T20 | R-PDSO-G16 | R-PDIP-T20 | R-PDIP-T16 | R-PDSO-G16 |
JESD-609 code | e0 | e0 | e3 | e0 | e3 | e0 | e3 | e0 | e0 | e3 |
normal position | NO/NC | NO/NC | NO | NO | NO | NO | NO | NO | NO/NC | NO/NC |
Number of functions | 2 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 2 |
Number of terminals | 16 | 16 | 16 | 16 | 20 | 20 | 16 | 20 | 16 | 16 |
Maximum on-state resistance (Ron) | 60 Ω | 100 Ω | 30 Ω | 75 Ω | 30 Ω | 100 Ω | 30 Ω | 75 Ω | 75 Ω | 60 Ω |
Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
output | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | DIP | DIP | QCCJ | DIP | SOP | DIP | DIP | SOP |
Encapsulate equivalent code | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | DIP20,.3 | SOP16,.25 | DIP20,.3 | DIP16,.3 | SOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
power supply | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V | 15,-3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | NO | NO | NO | YES | NO | YES | NO | NO | YES |
Maximum connection time | 100 ns | 100 ns | 130 ns | 70 ns | 130 ns | 70 ns | 130 ns | 70 ns | 100 ns | 100 ns |
switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
Is it Rohs certified? | - | incompatible | conform to | incompatible | conform to | incompatible | conform to | incompatible | incompatible | - |