(1-Form-B) relay that uses optically coupled MOSFET
technology to provide 3750V
rms
of input to output
isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The LCB120 has low on-resistance, and is well suited
for most applications requiring a normally closed relay.
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
Surface Mount Tape & Reel Version Available
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LCB120
LCB120S
LCB120STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
* For other packaging options consult factory.
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
I
LOAD
10%
t
off
t
on
90%
Pb
DS-LCB120-R09
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation voltage, Input to Output
Operational Temperature
Storage Temperature
1
1
LCB120
Ratings
250
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
,
Continuous
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=170mA
I
L
=300mA
I
F
=5mA, V
L
=250V
P
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz, I
F
=50mA
I
L
=170mA
-
I
F
=5mA
V
R
=5V
-
I
L
I
L
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
11
5
-
0.65
1.30
50
-
-
1.2
-
3
170
300
±400
20
6
1
5
5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
A
ms
ms
pF
mA
mA
V
A
pF
2
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PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
LCB120
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
35
30
Device Count (N)
Device Count (N)
35
30
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
25
20
15
10
5
1.17
1.19
1.21
1.23
1.25
0
0.30
0.42
0.54
0.66
0.78
0.90
Turn-On Time (ms)
0.625 0.875
1.125
1.375
1.625
1.875
LED Forward Voltage Drop (V)
Turn-Off Time (ms)
Typical I
F
for Switch Operation
(N=50, I
L
=170mA
DC
)
30
25
Device Count (N)
Device Count (N)
20
15
10
5
0
0.63
0.81
0.99
1.17
1.35
1.53
LED Current (mA)
Typical I
F
for Switch Dropout
(N=50, I
L
=170mA
DC
)
35
25
Device Count (N)
20
15
10
5
0
0.45
0.63
0.81
0.99
1.17
1.35
LED Current (mA)
35
30
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
L
=170mA
DC
)
10.4
10.8
11.2
11.6
12.0
12.4
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50, I
F
=5mA)
35
30
Device Count (N)
25
20
15
10
5
0
291.25 293.75 296.25 298.75 301.25 303.75
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
0.634
0.632
0.630
0.628
0.626
0.624
0.622
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=170mA
DC
)
1.2
Turn-Off Time (ms)
1.0
0.8
0.6
0.4
0.2
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=170mA
DC
)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R09
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PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Typical On-Resistance
vs. Temperature
(I
L
=170mA
DC
)
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
LCB120
60
On-Resistance ( )
50
40
30
20
10
0
-40
-20
0.12
Turn-On Time (ms)
0.10
0.08
0.06
0.04
0.02
0
2.5
Turn-Off Time (ms)
2.0
1.5
1.0
0.5
0
Typical Turn-Off Time
vs. Temperature
(I
L
=170mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
-40
-20
0
20
40
60
80
100
0
20
40
60
80
100
-40
-20
0
Temperature (ºC)
20
40
60
Temperature (ºC)
80
100
Temperature (ºC)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=170mA
DC
)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=170mA
DC
)
250
Load Current (mA)
200
150
100
50
0
Maximum Load Current
vs. Temperature
(I
F
=0mA)
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Temperature (ºC)
Typical Load Current
vs. Load Voltage
200
150
Blocking Voltage (V
P
)
310
305
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
0.030
0.025
Leakage ( A)
0.020
0.015
0.010
0.005
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(I
F
=5mA)
Load Current (mA)
100
50
0
-50
-100
-150
-200
-2.0
-1.5 -1.0 -0.5
0
0.5
1.0
1.5
2.0
300
295
290
285
-40
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Load Voltage (V)
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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Manufacturing Information
Moisture Sensitivity
LCB120
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LCB120 / LCB120S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LCB120 / LCB120S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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