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PEB2035-N

Description
ICs for Communications (Advanced CMOS Frame Aligner)
CategoryWireless rf/communication    Telecom circuit   
File Size526KB,134 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
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PEB2035-N Overview

ICs for Communications (Advanced CMOS Frame Aligner)

PEB2035-N Parametric

Parameter NameAttribute value
MakerSIEMENS
Parts packaging codeLCC
package instruction,
Contacts44
Reach Compliance Codeunknow
JESD-30 codeS-PQCC-J44
Number of functions1
Number of terminals44
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesFRAMER
Temperature levelCOMMERCIAL
Terminal formJ BEND
Terminal locationQUAD

PEB2035-N Related Products

PEB2035-N PEB2035 PEB2035-P
Description ICs for Communications (Advanced CMOS Frame Aligner) ICs for Communications (Advanced CMOS Frame Aligner) ICs for Communications (Advanced CMOS Frame Aligner)
Parts packaging code LCC - DIP
Contacts 44 - 40
Reach Compliance Code unknow - unknow
JESD-30 code S-PQCC-J44 - R-PDIP-T40
Number of functions 1 - 1
Number of terminals 44 - 40
Maximum operating temperature 70 °C - 70 °C
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY
Package shape SQUARE - RECTANGULAR
Package form CHIP CARRIER - IN-LINE
Certification status Not Qualified - Not Qualified
Nominal supply voltage 5 V - 5 V
surface mount YES - NO
technology CMOS - CMOS
Telecom integrated circuit types FRAMER - FRAMER
Temperature level COMMERCIAL - COMMERCIAL
Terminal form J BEND - THROUGH-HOLE
Terminal location QUAD - DUAL
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