Technical Data
4108
Effective
October
2017
Supersedes
March
2007
MP2
MICRO-PAC™ Low profile toroid power inductors
Applications
•
•
•
•
til
un
or
16 P2A
20 M
5, w
2
ly revie heet
Ju e
ve eas
a s ts.
at n
cti Pl
d
ffe d.
E te
18 eme
d, le
SD lac
ue e p
nd rep
in
nt is d 2) a te
co ry
is to
11 erna
D
(4 lt
en heet s a
inv s
)a
ta 311
da -4
PM
(
Environmental data
•
•
•
PC cards,
mobile phones
Disk drives
GPS systems
SMD Device
Product features
•
•
•
•
High performance, ferrite-based, low
profile,surface mount inductors
Small footprint and closed magnetic field
construction allow for low EMI
Low DCR and high efficiency
Ferrite core material
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Technical Data
4108
Effective
October
2017
MP2
MICRO-PAC™ Low profile toroid power inductors
Product specifications
Part
Number
MP2-R47-R
MP2-1R0-R
MP2-1R5-R
MP2-2R2-R
MP2-3R3-R
MP2-4R7-R
MP2-6R8-R
MP2-100-R
MP2-150-R
MP2-220-R
MP2-330-R
MP2-470-R
Inductance
µH
0.47
1.0
1.5
2.2
3.3
4.7
6.8
10.0
15.0
22.0
33.0
47.0
OCL (1)
µH ± 20%
0.40
1.02
1.59
2.29
3.58
4.60
7.02
9.95
15.30
21.80
33.70
46.40
Irms (2)
Amperes
(Typ.)
2.02
1.67
1.51
1.39
1.25
1.18
1.06
0.98
0.88
0.80
0.64
0.52
Isat (3)
Amperes
(Typ.)
3.40
2.10
1.70
1.40
1.10
1.00
0.80
0.68
0.54
0.45
0.37
0.31
DCR (4)
Ohms
(Max.)
0.075
0.103
0.118
0.130
0.156
0.180
0.202
0.240
0.300
0.360
0.556
0.833
Q (5)
(Typ.)
10
20
25
32
42
46
46
55
65
65
65
65
SRF
MHz
(Typ.)
300
160
155
150
140
130
110
100
60
45
35
28
1) Open Circuit Inductance Test Parameters: 100kHz, 0.250 Vrms, 0.0 Adc
2) RMS current, delta temp. of 40° C ambient temperature of 85° C
3) Peak current for approximately 30% roll-off
Dimensions- mm
Inductance characteristics
til
un
or
16 P2A
20 M
5, w
2
ly revie heet
Ju e
ve eas
a s ts.
at n
cti Pl
d
ffe d.
E te
18 eme
d, le
yww
SD lac
ue e p
nd rep
in
xxx
d
nt is
) a te
co ry
12 rna
is to
41 lte
D
n eet ( a
ve sh
in
as
ta 311)
da -4
PM
(
4) Values @ 20° C
5) Measured @ 300KHz
5.2 max.
1.05
5.88
7.50
max
1.8 max.
5.40
7.50
2.00
yww = Date Code
xxx = Inductance value per family chart
Do not route traces or vias underneath the inductor
OCL vs. Isat
120
100
% of (OCL)
80
60
40
20
0
0
40
80
% of Isat
1
2
www.eaton.com/electronics
MP2
MICRO-PAC™ Low profile toroid power inductors
Technical Data
4108
Effective
October
2017
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
til
un
or
16 P2A
20 M
5, w
2
ly revie heet
Ju e
ve eas
a s ts.
at n
cti Pl
d
ffe d.
E te
18 eme
d, le
SD lac
ue e p
nd rep
in
nt is d 2) a te
co ry
is to
11 erna
D
(4 lt
en heet s a
inv s
)a
ta 311
da -4
PM
(
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
T
smin
t
s
25°C
Time 25°C to Peak
Time
Temperature
T
smax
Volume
mm
3
>2000
260°C
245°C
245°C
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
Standard SnPb Solder
100°C
150°C
60-120 Seconds
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
6°C/ Second
Max.
6
Minutes Max.
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4108
October
2017
Eaton is a registered trademark.
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of their respective owners.