AS6C4008-55ZINTR datasheet, PDF

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AS6C4008-55ZINTR: DescriptionSRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM; Categorystorage storage; File Size513KB，14 Pages; ManufacturerAlliance Memory; Environmental Compliance

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AS6C4008-55ZINTR Overview

SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM

AS6C4008-55ZINTR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Reach Compliance Code	compliant
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e3
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Humidity sensitivity level	3
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP
Encapsulate equivalent code	TSOP32,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
power supply	3/5 V
Certification status	Not Qualified
Maximum standby current	0.00003 A
Minimum standby current	1.5 V
Maximum slew rate	0.06 mA
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

AS6C4008-55ZINTR Related Products

	AS6C4008-55ZINTR	AS6C4008-55BINTR	AS6C4008-55SIN	AS6C4008-55STINTR	AS6C4008-55PIN	AS6C4008-55TINTR	AS6C4008-55STIN	AS6C4008-55STINR
Description	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM	SRAM 4M, 2.7-5.5V, 55ns 512K x 8 Asynch SRAM
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	conform to	-
Reach Compliance Code	compliant	compliant	compliant	compliant	unknown	compliant	compliant	-
Maximum access time	55 ns	55 ns	55 ns	55 ns	-	55 ns	55 ns	-
I/O type	COMMON	COMMON	COMMON	COMMON	-	COMMON	COMMON	-
JESD-30 code	R-PDSO-G32	R-PBGA-B36	R-PDSO-G32	R-PDSO-G32	-	R-PDSO-G32	R-PDSO-G32	-
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	-	4194304 bit	4194304 bit	-
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-
memory width	8	8	8	8	-	8	8	-
Humidity sensitivity level	3	3	3	3	-	3	3	-
Number of terminals	32	36	32	32	-	32	32	-
word count	524288 words	524288 words	524288 words	524288 words	-	524288 words	524288 words	-
character code	512000	512000	512000	512000	-	512000	512000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	-	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-40 °C	-
organize	512KX8	512KX8	512KX8	512KX8	-	512KX8	512KX8	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSOP	FBGA	SOP	TSSOP	-	TSSOP	LSSOP	-
Encapsulate equivalent code	TSOP32,.46	BGA36,6X8,30	SOP32,.56	TSSOP32,.56,20	-	TSSOP32,.8,20	TSSOP32,.56,20	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, FINE PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	-
power supply	3/5 V	3/5 V	3/5 V	3/5 V	-	3/5 V	3/5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	-
Maximum standby current	0.00003 A	0.00003 A	0.00003 A	0.00003 A	-	0.00003 A	0.00003 A	-
Minimum standby current	1.5 V	1.5 V	2 V	1.5 V	-	1.5 V	2 V	-
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	-	0.06 mA	0.06 mA	-
surface mount	YES	YES	YES	YES	-	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	-
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-
Terminal form	GULL WING	BALL	GULL WING	GULL WING	-	GULL WING	GULL WING	-
Terminal pitch	1.27 mm	0.75 mm	1.27 mm	0.5 mm	-	0.5 mm	0.5 mm	-
Terminal location	DUAL	BOTTOM	DUAL	DUAL	-	DUAL	DUAL	-
Base Number Matches	1	-	1	1	1	1	1	-
package instruction	-	FBGA, BGA36,6X8,30	SOP, SOP32,.56	TSSOP, TSSOP32,.56,20	,	TSSOP, TSSOP32,.8,20	LSSOP, TSSOP32,.56,20	-
Factory Lead Time	-	8 weeks	8 weeks	8 weeks	-	8 weeks	8 weeks	-

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