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WF512K64-XG4WX5

Description
512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116
Categorystorage   
File Size212KB,10 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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WF512K64-XG4WX5 Overview

512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116

WF512K64-XG4WX5 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals116
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
Maximum supply/operating voltage5.5 V
Minimum supply/operating voltage4.5 V
Rated supply voltage5 V
maximum access time120 ns
Processing package descriptionCERAMIC, QFP-116
stateTRANSFERRED
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeMICROELECTRONIC ASSEMBLY
surface mountYes
Terminal formFLAT
terminal coatingNOT SPECIFIED
Terminal locationQUAD
Packaging MaterialsCERAMIC, METAL-SEALED COFIRED
Temperature levelMILITARY
memory width64
organize512K X 64
storage density3.36E7 deg
operating modeASYNCHRONOUS
Number of digits524288 words
Number of digits512K
Spare memory width32
Memory IC typeFLASH 5V PROM MODULE
serial parallelPARALLEL
WF512K64-XG4WX5
HI-RELIABILITY PRODUCT
512Kx64 5V FLASH MODULE
FEATURES
Access Times of 70, 90, 120, 150ns
Packaging
PRELIMINARY*
5 Volt Programming. 5V ± 10% Supply.
Low Power CMOS, 6.5mA Standby
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Built-in Decoupling Caps for Low Noise Operation
Page Program Operation and Internal Program Control Time
Weight
WF512K64-XG4WX5 - 20 grams typical
* This data sheet describes a product under development, not fully character-
ized, and is subject to change without notice.
Note: Programming information available upon request.
• 116 lead, 40mm square, Hermetic CQFP (Package 504)
100,000 Erase/Program Cycles Minimum
Sector Architecture
• 8 equal size sectors of 64KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase
Organized as 512Kx64, user configurable as 1Mx32, 2Mx16,
or 4Mx8.
Commercial, Industrial and Military Temperature Ranges
FIG. 1
PIN CONFIGURATION FOR WF512K64-XG4WX5
TOP VIEW
I/O
2
I/O
1
I/O
0
V
CC
WE
2
CS
2
NC
A
0
A
1
A
2
A
3
A
4
WE
1
CS
1
NC
CS
8
WE
8
A
5
A
6
A
7
A
8
A
9
NC
CS
7
WE
7
V
CC
I/O
63
I/O
62
I/O
61
A
0-18
OE
1
512K x 8
WE
1
CS
1
BLOCK DIAGRAM
WE
2
CS
2
WE
x
CS
x
WE
8
CS
8
2
512K x 8
......
8
8
512K x 8
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
GND
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
I/O
60
I/O
59
I/O
58
I/O
57
I/O
56
GND
I/O
55
I/O
54
I/O
53
I/O
52
I/O
51
I/O
50
I/O
49
I/O
48
GND
I/O
47
I/O
46
I/O
45
I/O
44
I/O
43
I/O
42
I/O
41
I/O
40
GND
I/O
39
I/O
38
I/O
37
I/O
36
I/O
35
8
8
8
I/O
0-7
I/O
8-15
I/O...
I/O
56-63
PIN
I/O
0-63
A
0-18
WE
1-8
CS
1-8
OE
V
CC
GND
NC
DESCRIPTION
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
May 1999 Rev.2
I/O
29
I/O
30
I/O
31
V
CC
WE
3
CS
3
NC
NC
A
18
A
17
A
16
A
15
WE
4
CS
4
OE
CS
5
WE
5
A
14
A
13
A
12
A
11
A
10
NC
CS
6
WE
6
V
CC
I/O
32
I/O
33
I/O
34
1
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520

WF512K64-XG4WX5 Related Products

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Description 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 90 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 150 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116 512K X 64 FLASH 5V PROM MODULE, 120 ns, CQMA116
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 116 116 116 116 116 116 116 116 116 116
Maximum operating temperature 125 Cel 125 °C 85 °C 70 °C 85 °C 70 °C 125 °C 70 °C 85 °C 70 °C
Minimum operating temperature -55 Cel -55 °C -40 °C - -40 °C - -55 °C - -40 °C -
surface mount Yes YES YES YES YES YES YES YES YES YES
Terminal form FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT FLAT
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Temperature level MILITARY MILITARY INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL MILITARY COMMERCIAL INDUSTRIAL COMMERCIAL
memory width 64 64 64 64 64 64 64 64 64 64
organize 512K X 64 512KX64 512KX64 512KX64 512KX64 512KX64 512KX64 512KX64 512KX64 512KX64
Spare memory width 32 32 32 32 32 32 32 32 32 32
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
package instruction - CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116 CERAMIC, QFP-116
Reach Compliance Code - unknown unknow unknow unknow unknow unknow unknow unknow unknow
Maximum access time - 90 ns 90 ns 90 ns 70 ns 70 ns 150 ns 150 ns 120 ns 120 ns
Other features - CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8 CONFIGURABLE AS 2M X 16 OR 4M X 8
Data polling - YES YES YES YES YES YES YES YES YES
JESD-30 code - S-CQMA-F116 S-CQMA-F116 S-CQMA-F116 S-CQMA-F116 S-CQMA-F116 S-CQMA-F116 S-CQMA-F116 S-CQMA-F116 S-CQMA-F116
memory density - 33554432 bit 33554432 bi 33554432 bi 33554432 bi 33554432 bi 33554432 bi 33554432 bi 33554432 bi 33554432 bi
Memory IC Type - FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE FLASH MODULE
Number of departments/size - 8 8 8 8 8 8 8 8 8
word count - 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code - 512000 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Package body material - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code - QFF QFF QFF QFF QFF QFF QFF QFF QFF
Encapsulate equivalent code - QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ QFL116,1.56SQ
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Programming voltage - 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Department size - 64K 64K 64K 64K 64K 64K 64K 64K 64K
Maximum standby current - 0.0012 A 0.0012 A 0.0012 A 0.0012 A 0.0012 A 0.0012 A 0.0012 A 0.0012 A 0.0012 A
Maximum slew rate - 0.48 mA 0.48 mA 0.48 mA 0.48 mA 0.48 mA 0.48 mA 0.48 mA 0.48 mA 0.48 mA
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal pitch - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
switch bit - NO NO NO NO NO NO NO NO NO
type - NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE

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