EP9315-CBZ datasheet, PDF - EEWORLD Datasheet

EP9315-CBZ: DescriptionMicroprocessors - MPU IC Universl Pltform ARM9 SOC Prcessor; CategoryThe embedded processor and controller Microcontrollers and processors; File Size7MB，825 Pages; ManufacturerCirrus Logic; Websitehttp://www.cirrus.com; Environmental Compliance

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Microprocessors - MPU IC Universl Pltform ARM9 SOC Prcessor

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Cirrus Logic
Parts packaging code	BGA
package instruction	BGA, BGA352(UNSPEC)
Contacts	352
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Address bus width	26
bit size	32
boundary scan	NO
maximum clock frequency	200 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B352
length	27 mm
low power mode	YES
Number of terminals	352
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA352(UNSPEC)
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8,3.3 V
Certification status	Not Qualified
Maximum seat height	2.5 mm
speed	200 MHz
Maximum supply voltage	1.94 V
Minimum supply voltage	1.65 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	27 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

	EP9315-CBZ	EP9315-IBZ
Description	Microprocessors - MPU IC Universl Pltform ARM9 SOC Prcessor	Microprocessors - MPU IC Universal Platfrm ARM9 SOC Prcessor
Is it Rohs certified?	conform to	conform to
Maker	Cirrus Logic	Cirrus Logic
Parts packaging code	BGA	BGA
package instruction	BGA, BGA352(UNSPEC)	BGA, BGA352(UNSPEC)
Contacts	352	352
Reach Compliance Code	compliant	compliant
ECCN code	3A001.A.3	3A001.A.3
Address bus width	26	26
bit size	32	32
boundary scan	NO	NO
maximum clock frequency	200 MHz	200 MHz
External data bus width	32	32
Format	FIXED POINT	FIXED POINT
Integrated cache	YES	YES
JESD-30 code	S-PBGA-B352	S-PBGA-B352
length	27 mm	27 mm
low power mode	YES	YES
Number of terminals	352	352
Maximum operating temperature	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Encapsulate equivalent code	BGA352(UNSPEC)	BGA352(UNSPEC)
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
power supply	1.8,3.3 V	1.8,3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.5 mm	2.5 mm
speed	200 MHz	200 MHz
Maximum supply voltage	1.94 V	1.94 V
Minimum supply voltage	1.65 V	1.65 V
Nominal supply voltage	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM
width	27 mm	27 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1

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