Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Microchip |
| package instruction | SOP, |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 7 weeks |
| Samacsys Description | Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver |
| high side driver | NO |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 4.9 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output peak current | 12 A |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.879 mm |
| Maximum supply voltage | 18 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BCDMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| Disconnect time | 0.04 µs |
| connection time | 0.08 µs |
| width | 3.9 mm |
| MIC4451YM | MIC4451YM-TR | MIC4452VM | MIC4451ZT | MIC4452VM-TR | MIC4451YN | MIC4452ZT | MIC4452YM-TR | |
|---|---|---|---|---|---|---|---|---|
| Description | Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver | Gate Drivers | Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver | Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver | Gate Drivers | Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver | Gate Drivers 12A Hi-Speed, Hi-Current Single MOSFET Driver | Gate Drivers |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Microchip | Microchip | Microchip | Microchip | Microchip | Microchip | Microchip | Microchip |
| package instruction | SOP, | SOP, | SOP, | , | SOP, | DIP, | , | SOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 7 weeks | 7 weeks | 7 weeks | 8 weeks | 7 weeks | 9 weeks | 8 weeks | 7 weeks |
| high side driver | NO | NO | NO | NO | NO | - | NO | NO |
| Interface integrated circuit type | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | - | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PSFM-T5 | R-PDSO-G8 | - | R-PSFM-T5 | R-PDSO-G8 |
| JESD-609 code | e4 | e4 | e4 | e3 | e4 | - | e3 | e4 |
| length | 4.9 mm | 4.9 mm | 4.9 mm | - | 4.9 mm | - | - | 4.9 mm |
| Humidity sensitivity level | 1 | 3 | 3 | - | 3 | - | - | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 5 | 8 | - | 5 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | 125 °C | 70 °C | 125 °C | - | 70 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | - | -40 °C | - | - | -40 °C |
| Nominal output peak current | 12 A | 12 A | 12 A | 12 A | 12 A | - | 12 A | 12 A |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | - | SOP | - | - | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | FLANGE MOUNT | SMALL OUTLINE | - | FLANGE MOUNT | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | NOT APPLICABLE | 260 | - | NOT APPLICABLE | 260 |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified |
| Maximum seat height | 1.879 mm | 1.879 mm | 1.879 mm | - | 1.879 mm | - | - | 1.879 mm |
| Maximum supply voltage | 18 V | 18 V | 18 V | 18 V | 18 V | - | 18 V | 18 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | - | 5 V | - | - | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | YES | - | NO | YES |
| technology | BCDMOS | BCDMOS | BCDMOS | BCDMOS | BCDMOS | - | BCDMOS | BCDMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | COMMERCIAL | AUTOMOTIVE | - | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Matte Tin (Sn) - annealed | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | - | - | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | SINGLE | DUAL | - | SINGLE | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | NOT APPLICABLE | 40 | - | NOT APPLICABLE | 40 |
| Disconnect time | 0.04 µs | 0.04 µs | 65 µs | 0.04 µs | 65 µs | - | 0.04 µs | 0.04 µs |
| connection time | 0.08 µs | 0.08 µs | 80 µs | 0.08 µs | 80 µs | - | 0.08 µs | 0.08 µs |
| width | 3.9 mm | 3.9 mm | 3.9 mm | - | 3.9 mm | - | - | 3.9 mm |
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