|
SST39VF400A-70-4I-M1QE |
SST39VF800A-90-4I-B3KE-T |
SST39VF400A-70-4I-M1QE-T |
SST39VF400A-70-4C-C1QE |
SST39VF800A-70-4I-M1QE |
Description |
NOR Flash 2.7V to 3.6V 4Mb Multi-Purpose Flash |
Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash |
Flash Memory 2.7V to 3.6V 4Mb Multi-Purpose Flash |
Flash Memory 2.7V to 3.6V 4Mb Multi-Purpose Flash |
Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash |
Is it lead-free? |
Lead free |
- |
Lead free |
- |
Lead free |
Is it Rohs certified? |
conform to |
- |
conform to |
conform to |
conform to |
Maker |
Microchip |
- |
Microchip |
Microchip |
Microchip |
Parts packaging code |
DSBGA |
- |
- |
DSBGA |
DSBGA |
package instruction |
4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207C2B-4, WFBGA-48 |
- |
- |
4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, XFLGA-48 |
VFBGA, BGA48,6X11,20 |
Contacts |
48 |
- |
- |
48 |
48 |
Reach Compliance Code |
compliant |
- |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
- |
- |
EAR99 |
EAR99 |
Maximum access time |
70 ns |
- |
70 ns |
70 ns |
70 ns |
command user interface |
YES |
- |
YES |
YES |
YES |
Universal Flash Interface |
YES |
- |
YES |
YES |
YES |
Data polling |
YES |
- |
YES |
YES |
YES |
JESD-30 code |
R-PBGA-B48 |
- |
R-PBGA-B48 |
R-PBGA-B48 |
R-PBGA-B48 |
JESD-609 code |
e1 |
- |
e1 |
e1 |
e1 |
length |
6 mm |
- |
- |
6 mm |
6 mm |
memory density |
4194304 bit |
- |
4194304 bit |
4194304 bit |
8388608 bit |
Memory IC Type |
FLASH |
- |
FLASH |
FLASH |
FLASH |
memory width |
16 |
- |
16 |
16 |
16 |
Humidity sensitivity level |
3 |
- |
3 |
- |
3 |
Number of functions |
1 |
- |
- |
1 |
1 |
Number of departments/size |
128 |
- |
128 |
128 |
256 |
Number of terminals |
48 |
- |
48 |
48 |
48 |
word count |
262144 words |
- |
262144 words |
262144 words |
524288 words |
character code |
256000 |
- |
256000 |
256000 |
512000 |
Operating mode |
ASYNCHRONOUS |
- |
- |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
- |
85 °C |
70 °C |
85 °C |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
- |
-40 °C |
organize |
256KX16 |
- |
256KX16 |
256KX16 |
512KX16 |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
VFBGA |
- |
FBGA |
VFLGA |
VFBGA |
Encapsulate equivalent code |
BGA48,6X11,20 |
- |
BGA48,6X11,20 |
LGA48,6X11,20 |
BGA48,6X11,20 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
- |
GRID ARRAY, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial |
PARALLEL |
- |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
260 |
- |
260 |
260 |
260 |
power supply |
3/3.3 V |
- |
3/3.3 V |
3/3.3 V |
3/3.3 V |
Programming voltage |
2.7 V |
- |
- |
2.7 V |
2.7 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.73 mm |
- |
- |
0.52 mm |
0.73 mm |
Department size |
2K |
- |
2K |
2K |
2K |
Maximum standby current |
0.00002 A |
- |
0.00002 A |
0.00002 A |
0.00002 A |
Maximum slew rate |
0.03 mA |
- |
0.03 mA |
0.03 mA |
0.03 mA |
Maximum supply voltage (Vsup) |
3.6 V |
- |
- |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
- |
- |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
- |
- |
3 V |
3 V |
surface mount |
YES |
- |
YES |
YES |
YES |
technology |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
TIN SILVER COPPER |
TIN SILVER COPPER |
Terminal form |
BALL |
- |
BALL |
BUTT |
BALL |
Terminal pitch |
0.5 mm |
- |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
BOTTOM |
- |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
- |
40 |
40 |
40 |
switch bit |
YES |
- |
YES |
YES |
YES |
type |
NOR TYPE |
- |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
4 mm |
- |
- |
4 mm |
4 mm |