Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Microchip |
| Parts packaging code | DSBGA |
| package instruction | VFBGA, BGA48,6X11,20 |
| Contacts | 48 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 70 ns |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | R-PBGA-B48 |
| JESD-609 code | e1 |
| length | 6 mm |
| memory density | 8388608 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of departments/size | 256 |
| Number of terminals | 48 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512KX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA48,6X11,20 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/3.3 V |
| Programming voltage | 2.7 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.73 mm |
| Department size | 2K |
| Maximum standby current | 0.00002 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN SILVER COPPER |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| switch bit | YES |
| type | NOR TYPE |
| width | 4 mm |
| SST39VF800A-70-4I-M1QE | SST39VF800A-90-4I-B3KE-T | SST39VF400A-70-4I-M1QE-T | SST39VF400A-70-4C-C1QE | SST39VF400A-70-4I-M1QE | |
|---|---|---|---|---|---|
| Description | Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash | Flash Memory 2.7 to 3.6V 8Mbit Multi-Purpose Flash | Flash Memory 2.7V to 3.6V 4Mb Multi-Purpose Flash | Flash Memory 2.7V to 3.6V 4Mb Multi-Purpose Flash | NOR Flash 2.7V to 3.6V 4Mb Multi-Purpose Flash |
| Is it lead-free? | Lead free | - | Lead free | - | Lead free |
| Is it Rohs certified? | conform to | - | conform to | conform to | conform to |
| Maker | Microchip | - | Microchip | Microchip | Microchip |
| Parts packaging code | DSBGA | - | - | DSBGA | DSBGA |
| package instruction | VFBGA, BGA48,6X11,20 | - | - | 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, XFLGA-48 | 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207C2B-4, WFBGA-48 |
| Contacts | 48 | - | - | 48 | 48 |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant |
| ECCN code | EAR99 | - | - | EAR99 | EAR99 |
| Maximum access time | 70 ns | - | 70 ns | 70 ns | 70 ns |
| command user interface | YES | - | YES | YES | YES |
| Universal Flash Interface | YES | - | YES | YES | YES |
| Data polling | YES | - | YES | YES | YES |
| JESD-30 code | R-PBGA-B48 | - | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
| JESD-609 code | e1 | - | e1 | e1 | e1 |
| length | 6 mm | - | - | 6 mm | 6 mm |
| memory density | 8388608 bit | - | 4194304 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | FLASH | - | FLASH | FLASH | FLASH |
| memory width | 16 | - | 16 | 16 | 16 |
| Humidity sensitivity level | 3 | - | 3 | - | 3 |
| Number of functions | 1 | - | - | 1 | 1 |
| Number of departments/size | 256 | - | 128 | 128 | 128 |
| Number of terminals | 48 | - | 48 | 48 | 48 |
| word count | 524288 words | - | 262144 words | 262144 words | 262144 words |
| character code | 512000 | - | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | - | 85 °C | 70 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | - | -40 °C |
| organize | 512KX16 | - | 256KX16 | 256KX16 | 256KX16 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VFBGA | - | FBGA | VFLGA | VFBGA |
| Encapsulate equivalent code | BGA48,6X11,20 | - | BGA48,6X11,20 | LGA48,6X11,20 | BGA48,6X11,20 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | - | 260 | 260 | 260 |
| power supply | 3/3.3 V | - | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| Programming voltage | 2.7 V | - | - | 2.7 V | 2.7 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.73 mm | - | - | 0.52 mm | 0.73 mm |
| Department size | 2K | - | 2K | 2K | 2K |
| Maximum standby current | 0.00002 A | - | 0.00002 A | 0.00002 A | 0.00002 A |
| Maximum slew rate | 0.03 mA | - | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | 3.6 V | - | - | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V | - | - | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V | - | - | 3 V | 3 V |
| surface mount | YES | - | YES | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | TIN SILVER COPPER | - | Tin/Silver/Copper (Sn/Ag/Cu) | TIN SILVER COPPER | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL | - | BALL | BUTT | BALL |
| Terminal pitch | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm |
| Terminal location | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | 40 | - | 40 | 40 | 40 |
| switch bit | YES | - | YES | YES | YES |
| type | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 4 mm | - | - | 4 mm | 4 mm |
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