|
NLAS4051DTR2G |
NLAS4051DR2G |
Description |
Multiplexer Switch ICs SP8T Mux/Demux TTL Compat -55 to 125 |
Multiplexer Switch ICs SP8T Mux/Demux TTL Compat -55 to 125 |
Brand Name |
ON Semiconductor |
ON Semiconductor |
Is it lead-free? |
Lead free |
Lead free |
Maker |
ON Semiconductor |
ON Semiconductor |
Parts packaging code |
TSSOP |
SOIC |
package instruction |
TSSOP, TSSOP16,.25 |
SOP, SOP16,.25 |
Contacts |
16 |
16 |
Manufacturer packaging code |
948F-01 |
751B-05 |
Reach Compliance Code |
compliant |
compliant |
Factory Lead Time |
1 week |
1 week |
Other features |
ALSO OPERATE WITH 2.5 TO 5.5V SINGLE SUPPLY |
ALSO OPERATE WITH 2.5 TO 5.5V SINGLE SUPPLY |
Analog Integrated Circuits - Other Types |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
JESD-30 code |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e4 |
e3 |
length |
5 mm |
9.9 mm |
Humidity sensitivity level |
1 |
1 |
Maximum negative supply voltage (Vsup) |
-5.5 V |
-5.5 V |
Nominal Negative Supply Voltage (Vsup) |
-3 V |
-3 V |
Number of channels |
8 |
8 |
Number of functions |
1 |
1 |
Number of terminals |
16 |
16 |
Nominal off-state isolation |
93 dB |
93 dB |
On-state resistance matching specifications |
15 Ω |
15 Ω |
Maximum on-state resistance (Ron) |
37 Ω |
37 Ω |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
Encapsulate equivalent code |
TSSOP16,.25 |
SOP16,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
-3,3/5 V |
-3,3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.75 mm |
Maximum signal current |
0.05 A |
0.05 A |
Maximum supply current (Isup) |
0.08 mA |
0.08 mA |
Maximum supply voltage (Vsup) |
6.6 V |
6.6 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
surface mount |
YES |
YES |
Maximum disconnect time |
28 ns |
28 ns |
Maximum connection time |
28 ns |
28 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin (Sn) |
Terminal form |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
40 |
width |
4.4 mm |
3.9 mm |