Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm
2
1 oz. copper bond pad, on a FR4 board)
Symbol
R
θJC
Typ
−
Max
2.4
Unit
°C/W
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(i
F
= 5 Amps, T
J
= 100°C)
(i
F
= 5 Amps, T
J
= 25°C)
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, T
J
= 100°C)
(Rated dc Voltage, T
J
= 25°C)
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
v
F
V
0.60
0.65
1.5
0.015
0.72
0.78
mA
2.5
0.150
i
R
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2
MBR560MFS, NRVB560MFS
TYPICAL CHARACTERISTICS
10
i
F
, INSTANTANEOUS FORWARD
CURRENT (A)
i
F
, INSTANTANEOUS FORWARD
CURRENT (A)
T
A
= 175°C
10
T
A
= 175°C
T
A
= 150°C
1
T
A
= 100°C
T
A
= 150°C
1
T
A
= 100°C
T
A
= 25°C
T
A
=
−40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
T
A
= 25°C
T
A
=
−40°C
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
0.1
0.1
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
T
A
=
−40°C
0
10
20
30
40
50
60
T
A
= 25°C
T
A
= 175°C
T
A
= 150°C
T
A
= 100°C
I
R
, INSTANTANEOUS REVERSE CURRENT (A)
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
T
A
= 175°C
T
A
= 150°C
T
A
= 100°C
1.E+00
1.E−01
1.E−02
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
0
10
20
30
40
50
60
T
A
= 25°C
T
A
=
−40°C
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
1000
C, JUNCTION CAPACITANCE (pF)
T
J
= 25°C
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
10
9
8
7
6
5
4
3
2
1
0
Figure 4. Maximum Reverse Characteristics
R
qJC
= 2.4°C/W
DC
100
Square Wave
10
0
10
20
30
40
50
60
60
80
100
120
140
160
V
R
, REVERSE VOLTAGE (V)
T
C
, CASE TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating TO−220AB
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3
MBR560MFS, NRVB560MFS
TYPICAL CHARACTERISTICS
8
P
F(AV)
, AVERAGE FORWARD
POWER DISSIPATION (W)
7
6
5
4
3
2
1
0
0
1
2
3
DC
Square Wave
I
PK
/I
AV
= 5
I
PK
/I
AV
= 20
I
PK
/I
AV
= 10
T
J
= 175°C
4
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
100
50% Duty Cycle
20%
10 10%
5%
R(t) (°C/W)
2%
1
1%
Assumes 25°C ambient and soldered to
a 600 mm
2
−
oz copper pad on PCB
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 8. Thermal Characteristics
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4
MBR560MFS, NRVB560MFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE G
2X
0.20 C
D
2
D1
A
B
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15 BSC
4.50
4.90
5.10
3.50
−−−
4.22
6.15 BSC
5.50
5.80
6.10
3.45
−−−
4.30
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.05
0.17
0.20
3.00
3.40
3.80
0
_
−−−
12
_
0.20 C
E1
2
E
c
4X
q
A1
1
2
3
4
TOP VIEW
3X
C
SEATING
PLANE
0.10 C
A
0.10 C
SIDE VIEW
8X
e
DETAIL A
DETAIL A
SOLDERING FOOTPRINT*
1.270
3X
b
e/2
1
4
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.10
0.05
C A B
c
L
0.750
4X
1.000
4X
K
E2
L1
1.330
M
0.965
0.905
4.530
0.475
2X
2X
PIN 5
(EXPOSED PAD)
0.495
3.200
2X
G
D2
BOTTOM VIEW
4.560
1.530
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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