DDR SDRAM stacked 512Mb E-die (x4/x8)
st. 512Mb E-die Revision History
Revision 1.0 (July, 2003)
- First version release.
DDR SDRAM
Rev. 1.0 July. 2003
DDR SDRAM stacked 512Mb E-die (x4/x8)
Key Features
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe DQS
• Four banks operation
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• MRS cycle with address key programs
-. Read latency 2, 2.5 (clock)
-. Burst length (2, 4, 8)
-. Burst type (sequential & interleave)
• All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
• Data I/O transactions on both edges of data strobe
• Edge aligned data output, center aligned data input
• DM for write masking only (x4, x8)
• Auto & Self refresh
• 7.8us refresh interval(8K/64ms refresh)
• Maximum burst refresh cycle : 8
• 66pin TSOP II package
DDR SDRAM
Ordering Information
Part No.
K4H510638E-TC/LAA
K4H510638E-TC/LA2
K4H510638E-TC/LB0
K4H510738E-TC/LAA
K4H510738E-TC/LA2
K4H510738E-TC/LB0
st.64M x 8
st.128M x 4
Org.
Max Freq.
AA(DDR266@CL=2)
A2(DDR266@CL=2)
B0(DDR266@CL=2.5)
AA(DDR266@CL=2)
A2(DDR266@CL=2)
B0(DDR266@CL=2.5)
SSTL2
66pin TSOP II
SSTL2
66pin TSOP II
Interface
Package
Operating Frequencies
AA(DDR266@CL=2.0)
Speed @CL2
Speed @CL2.5
CL-tRCD-tRP
*CL : CAS Latency
133MHz
133MHz
2-2-2
A2(DDR266@CL=2.0)
133MHz
133MHz
2-3-3
B0(DDR266@CL=2.5)
100MHz
133MHz
2.5-3-3
Rev. 1.0 July. 2003
DDR SDRAM stacked 512Mb E-die (x4/x8)
Pin Description
DDR SDRAM
st.64Mb x 8
st.128Mb x 4
V
DD
DQ
0
V
DDQ
NC
DQ
1
V
SSQ
NC
DQ
2
V
DDQ
NC
DQ
3
V
SSQ
NC
NC
V
DDQ
NC
NC
V
DD
NC
NC
WE
CAS
RAS
CS0
CS1
BA
0
BA
1
AP/A
10
A
0
A
1
A
2
A
3
V
DD
V
DD
NC
V
DDQ
NC
DQ
0
V
SSQ
NC
NC
V
DDQ
NC
DQ
1
V
SSQ
NC
NC
V
DDQ
NC
NC
V
DD
NC
NC
WE
CAS
RAS
CS0
CS1
BA
0
BA
1
AP/A
10
A
0
A
1
A
2
A
3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
66
65
64
63
62
61
60
59
58
V
SS
NC
V
SSQ
NC
DQ
3
V
DDQ
NC
NC
V
SSQ
NC
DQ
2
V
DDQ
NC
NC
V
SSQ
DQS
NC
V
REF
V
SS
DM
CK
CK
CKE0
CKE1
A
12
A
11
A
9
A
8
A
7
A
6
A
5
A
4
V
SS
V
SS
DQ
7
V
SSQ
NC
DQ
6
V
DDQ
NC
DQ
5
V
SSQ
NC
DQ
4
V
DDQ
NC
NC
V
SSQ
DQS
NC
V
REF
V
SS
DM
CK
CK
CKE0
CKE1
A
12
A
11
A
9
A
8
A
7
A
6
A
5
A
4
V
SS
66Pin TSOPII
(400mil x 875mil)
(0.65mm Pin Pitch)
Bank Address
BA0~BA1
Auto Precharge
A10
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
stacked 512Mb TSOP-II Package Pinout
Organization
st.128Mx4
st.64Mx8
Row Address
A0~A12
A0~A12
Column Address
A0-A9, A11
A0-A9
DM is internally loaded to match DQ and DQS identically.
Row & Column address configuration
Rev. 1.0 July. 2003
DDR SDRAM stacked 512Mb E-die (x4/x8)
Package Physical Dimension
#66
#34
DDR SDRAM
Units : Millimeters
0.45~0.75
10.16
0.125
-
0.035
+0.075
11.76±0.20
#1
22.62MAX
22.22
±
0.10
#33
2.54(max)
(0.50)
5)
(R
0 .2
0.65
0.25
±
0.08
(0.71)
0.05(min)
0×~8×
NOTE
1. (
) IS REFERENCE
2. [
] IS ASS’Y OUT QUALITY
66pin TSOPII / Package dimension
Block Diagram
CK,CK,CAS
RAS,WE,DM
CKE1,CS1
CK,CK,CAS
RAS,WE,DM
CKE1,CS1
64Mx4
32Mx8
64Mx4
CKE0,CS0
I/O0-I/O3,DQS
A0-A12,BA0,BA1
CKE0,CS0
32Mx8
I/O 0 ~ I/O 3, DQSA0-A12, BA0,BA1
st.128Mb x 4
st.64Mb x 8
Rev. 1.0 July. 2003
(R
0.
25
)
0.25TYP
0.45~0.75
(4
×
)
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