|
74HCT367N652 |
74HC367PW |
74HC367DB |
74HCT367DB118 |
74HC367PW-T |
74HC367D-T |
74HCT367DB-T |
Description |
Buffers & Line Drivers HEX BUFF/DRVR 3ST |
Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S |
Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S |
Buffers & Line Drivers HEX BUFFER 4-BIT AND |
Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S |
Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S |
Buffers & Line Drivers HEX BUFFER 4-BIT AND 2-BIT 3-S |
Is it Rohs certified? |
- |
conform to |
conform to |
- |
conform to |
conform to |
conform to |
Maker |
- |
NXP |
NXP |
- |
NXP |
NXP |
- |
Parts packaging code |
- |
TSSOP |
SOIC |
- |
TSSOP |
SOIC |
SOIC |
package instruction |
- |
TSSOP, TSSOP16,.25 |
PLASTIC, SSOP-16 |
- |
TSSOP, |
SOP, |
SSOP, |
Contacts |
- |
16 |
16 |
- |
16 |
16 |
16 |
Reach Compliance Code |
- |
compliant |
unknown |
- |
unknown |
compliant |
unknown |
Other features |
- |
ONE FUNCTION WITH TWO BITS |
ONE FUNCTION WITH TWO BITS |
- |
ONE FUNCTION WITH TWO BITS |
ONE FUNCTION WITH TWO BITS |
ONE FUNCTION WITH TWO BITS |
series |
- |
HC/UH |
HC/UH |
- |
HC/UH |
HC/UH |
HCT |
JESD-30 code |
- |
R-PDSO-G16 |
R-PDSO-G16 |
- |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
- |
e4 |
e4 |
- |
e4 |
e4 |
e4 |
length |
- |
5 mm |
6.2 mm |
- |
5 mm |
- |
6.2 mm |
Load capacitance (CL) |
- |
50 pF |
50 pF |
- |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
- |
BUS DRIVER |
BUS DRIVER |
- |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
Humidity sensitivity level |
- |
1 |
1 |
- |
1 |
1 |
1 |
Number of digits |
- |
6 |
6 |
- |
6 |
6 |
6 |
Number of functions |
- |
1 |
1 |
- |
1 |
1 |
1 |
Number of ports |
- |
2 |
2 |
- |
2 |
2 |
2 |
Number of terminals |
- |
16 |
16 |
- |
16 |
16 |
16 |
Maximum operating temperature |
- |
125 °C |
125 °C |
- |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
Output characteristics |
- |
3-STATE |
3-STATE |
- |
3-STATE |
3-STATE |
3-STATE |
Output polarity |
- |
TRUE |
TRUE |
- |
TRUE |
TRUE |
TRUE |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
- |
TSSOP |
SSOP |
- |
TSSOP |
SOP |
SSOP |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
- |
260 |
260 |
- |
260 |
260 |
260 |
propagation delay (tpd) |
- |
29 ns |
29 ns |
- |
29 ns |
29 ns |
38 ns |
Certification status |
- |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
- |
1.1 mm |
2 mm |
- |
1.1 mm |
- |
2 mm |
Maximum supply voltage (Vsup) |
- |
6 V |
6 V |
- |
6 V |
6 V |
5.5 V |
Minimum supply voltage (Vsup) |
- |
2 V |
2 V |
- |
2 V |
2 V |
4.5 V |
Nominal supply voltage (Vsup) |
- |
5 V |
5 V |
- |
5 V |
5 V |
5 V |
surface mount |
- |
YES |
YES |
- |
YES |
YES |
YES |
technology |
- |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
Temperature level |
- |
AUTOMOTIVE |
AUTOMOTIVE |
- |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
- |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
- |
NICKEL PALLADIUM GOLD |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NICKEL PALLADIUM GOLD |
Terminal form |
- |
GULL WING |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
- |
0.65 mm |
0.65 mm |
- |
0.65 mm |
- |
0.65 mm |
Terminal location |
- |
DUAL |
DUAL |
- |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
- |
30 |
30 |
- |
30 |
30 |
30 |
width |
- |
4.4 mm |
5.3 mm |
- |
4.4 mm |
- |
5.3 mm |