ER1002 datasheet, PDF - EEWORLD Datasheet

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ER1002: Description10 A, 200 V, SILICON, RECTIFIER DIODE, TO-220AC; CategoryDiscrete semiconductor diode; File Size73KB，2 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ER1002 Overview

10 A, 200 V, SILICON, RECTIFIER DIODE, TO-220AC

ER1002 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
Parts packaging code	TO-220AC
package instruction	ROHS COMPLIANT, PLASTIC PACKAGE-2
Contacts	3
Reach Compliance Code	_compli
Is Samacsys	N
Other features	LOW POWER LOSS
application	EFFICIENCY
Configuration	SINGLE
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
JEDEC-95 code	TO-220AC
JESD-30 code	R-PSFM-T2
Maximum non-repetitive peak forward current	150 A
Number of components	1
Phase	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Maximum output current	10 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	FLANGE MOUNT
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	200 V
Maximum reverse recovery time	0.035 µs
surface mount	NO
Terminal form	THROUGH-HOLE
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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ER1000~ER1006

SUPERFAST RECOVERY RECTIFIERS

VOLTAGE

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O.

Flame Retardant Epoxy Molding Compound.

• Exceeds environmental standards of MIL-S-19500/228

• Low power loss, high efficiency.

• Low forwrd voltge, high current capability

• High surge capacity.

• Super fast recovery times, high voltage.

• In compliance with EU RoHS 2002/95/EC directives

.058(1.47)

50 to 600 Volts

CURRENT

10 Amperes

MECHANICALDATA

• Case: TO-220AC Molded plastic

• Terminals: Lead solderable per MIL-STD-750, Method 2026

• Polarity: As marked.

• Standard packaging: Any

• Weight: 0.0655 ounces, 1.859 grams.

.042(1.07)

MAXIMUM RATING AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

PA RA M E TE R

M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e

M a xi m um R M S V o l t a g e

M a xi m um D C B l o c k i ng V o l t a g e

M a x i m u m A v e r a g e F o r w a r d C u r r e n t a t Tc = 1 0 0

P e a k F o r w a r d S ur g e C ur r e nt , 8 . 3 m s s i ng l e ha l f s i ne - w a ve

s up e r i m p o s e d o n r a t e d l o a d ( J E D E C m e t ho d )

M a xi m um F o r w a r d V o l t a g e a t 1 0 A , p e r e l e m e nt

M a xi m um D C R e ve r s e C ur r e nt a t T

= 2 5

R a t e d D C B l o c k i ng V o l t a g e T

= 1 0 0

M a x i m u m R e v e r s e R e c o v e r y Ti m e ( N o t e 2 )

Ty p i c a l J u n c t i o n c a p a c i t a n c e ( N o t e 1 )

Ty p i c a l T h e r m a l R e s i s t a n c e

O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a n g e

S YM B O L

E R 1 0 0 0 E R 1 0 0 1 E R 1 0 0 1 A E R 1 0 0 2 E R 1 0 0 3 E R 1 0 0 4 E R 1 0 0 6

U N I T S

RRM

RMS

F ( A V )

F S M

J C

, T

S TG

100

150

105

150

200

140

200

1 0 .0

150

300

210

300

400

280

400

600

420

600

0 .9 5

1 .0

500

1 .3 0

1.7

C /

3 .0

-5 5 to +1 5 0

NOTES:

1. Measured at 1 MHz and applied reverse voltage of 4.0 VDC.

2. Reverse Recovery Test Conditions: I

=.5A, I

=1A, Irr=.25A.

3. Both Bonding and Chip structure are available.

STAD-MAR.06.2009

PAGE . 1

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