BSC094N03S G
OptiMOS
®
2 Power-Transistor
Features
• Fast switching MOSFET for SMPS
• Optimized technology for notebook DC/DC converters
• Qualified according to JEDEC
1)
for target applications
• N-channel
• Logic level
• Excellent gate charge x
R
DS(on)
product (FOM)
• Very low on-resistance
R
DS(on)
• Superior thermal resistance
• Avalanche rated
• Pb-free plating; RoHS compliant
Type
BSC094N03S G
Package
P-TDSON-8
Ordering Code
Q67042 S4291
Product Summary
V
DS
R
DS(on),max
I
D
30
9.4
35
V
mΩ
A
P-TDSON-8
Marking
094N03S
Maximum ratings,
at
T
j
=25 °C, unless otherwise specified
Parameter
Continuous drain current
Symbol Conditions
I
D
T
C
=25 °C
T
C
=100 °C
T
A
=25 °C,
R
thJA
=45 K/W
2)
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt
Gate source voltage
Power dissipation
I
D,pulse
E
AS
dv /dt
V
GS
P
tot
T
C
=25 °C
T
A
=25 °C,
R
thJA
=45 K/W
2)
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Rev. 1.01
page 1
T
j
,
T
stg
T
C
=25 °C
3)
I
D
=35 A,
R
GS
=25
Ω
I
D
=40 A,
V
DS
=24 V,
di /dt =200 A/µs,
T
j,max
=150 °C
Value
35
35
14.6
140
90
6
±20
52
2.8
-55 ... 150
55/150/56
2004-12-15
°C
mJ
kV/µs
V
W
Unit
A
BSC094N03S G
Parameter
Symbol Conditions
min.
Thermal characteristics
Thermal resistance, junction - case
Thermal resistance,
junction - ambient
R
thJC
R
thJA
minimal footprint
6 cm
2
cooling area
2)
-
-
-
-
-
-
2.4
62
45
K/W
Values
typ.
max.
Unit
Electrical characteristics,
at
T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
V
(BR)DSS
V
GS
=0 V,
I
D
=1 mA
V
GS(th)
I
DSS
V
DS
=V
GS
,
I
D
=25 µA
V
DS
=30 V,
V
GS
=0 V,
T
j
=25 °C
V
DS
=30 V,
V
GS
=0 V,
T
j
=125 °C
Gate-source leakage current
Drain-source on-state resistance
I
GSS
R
DS(on)
V
GS
=20 V,
V
DS
=0 V
V
GS
=4.5 V,
I
D
=30 A
V
GS
=10 V,
I
D
=35 A
Gate resistance
Transconductance
R
G
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=35 A
30
1.2
-
-
1.6
0.1
-
2
1
µA
V
-
-
-
-
-
26
10
10
11.2
7.8
1
53
100
100
14
9.4
-
-
Ω
S
nA
mΩ
1)
2)
J-STD20 and JESD22
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
2)
See figure 3
Rev. 1.01
page 2
2004-12-15
BSC094N03S G
Parameter
Symbol Conditions
min.
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Charge Characteristics
3)
Gate to source charge
Gate charge at threshold
Gate to drain charge
Switching charge
Gate charge total
Gate plateau voltage
Gate charge total, sync. FET
Output charge
Reverse Diode
Diode continous forward current
Diode pulse current
Diode forward voltage
I
S
I
S,pulse
V
SD
T
C
=25 °C
V
GS
=0 V,
I
F
=35 A,
T
j
=25 °C
V
R
=15 V,
I
F
=I
S
,
di
F
/dt =400 A/µs
-
-
-
-
-
0.93
35
140
1.2
V
A
Q
gs
Q
g(th)
Q
gd
Q
sw
Q
g
V
plateau
Q
g(sync)
Q
oss
V
DS
=0.1 V,
V
GS
=0 to 5 V
V
DD
=15 V,
V
GS
=0 V
V
DD
=15 V,
I
D
=17.5 A,
V
GS
=0 to 5 V
-
-
-
-
-
-
-
-
4.3
2.2
2.8
4.9
10
3.2
9
11
5.7
2.9
4.2
7.0
14
-
12
14
V
nC
nC
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DD
=15 V,
V
GS
=10 V,
I
D
=17.5 A,
R
G
=2.7
Ω
V
GS
=0 V,
V
DS
=15 V,
f
=1 MHz
-
-
-
-
-
-
-
1350
480
64
4.5
3.8
18
3.0
1800
640
96
6.8
5.7
27
4.5
ns
pF
Values
typ.
max.
Unit
Reverse recovery charge
Q
rr
-
-
10
nC
3)
See figure 16 for gate charge parameter definition
Rev. 1.01
page 3
2004-12-15
BSC094N03S G
1 Power dissipation
P
tot
=f(T
C
)
2 Drain current
I
D
=f(T
C
);
V
GS
≥10
V
60
40
50
30
40
P
tot
[W]
30
I
D
[A]
0
40
80
120
160
20
20
10
10
0
0
0
40
80
120
160
T
C
[°C]
T
C
[°C]
3 Safe operating area
I
D
=f(V
DS
);
T
C
=25 °C;
D
=0
parameter:
t
p
10
3
1000
4 Max. transient thermal impedance
Z
thJC
=f(t
p
)
parameter:
D
=t
p
/T
10
1
10
limited by on-state
resistance
1 µs
10
2
100
10 µs
10
0
100 µs
DC
0.5
1
10
1
Z
thJC
[K/W]
0.2
I
D
[A]
10
0.1
0.05
0.1
1 ms
10 ms
10
-1
0.02
0.01
single pulse
10
0
1
10
-1
0.1
0.1
1
10
100
10
-2
2
0.01
0
0
0
0
0
0
10
-1
10
0
V
DS
[V]
10
1
10
10
-6
10
-5
10
-4
t
p
[s]
10
-3
10
-2
10
-1
Rev. 1.01
page 4
2004-12-15
BSC094N03S G
5 Typ. output characteristics
I
D
=f(V
DS
);
T
j
=25 °C
parameter:
V
GS
80
70
60
50
10 V
6 Typ. drain-source on resistance
R
DS(on)
=f(I
D
);
T
j
=25 °C
parameter:
V
GS
30
3V
3.2 V
3.4 V
3.7 V
4.5 V
25
4V
20
R
DS(on)
[m
Ω
]
I
D
[A]
4V
40
30
3.7 V
15
4.5 V
3.4 V
10
10 V
20
10
0
0
1
2
3.2 V
5
3V
2.8 V
0
3
0
10
20
30
40
50
V
DS
[V]
I
D
[A]
7 Typ. transfer characteristics
I
D
=f(V
GS
); |V
DS
|>2|I
D
|R
DS(on)max
parameter:
T
j
80
70
60
50
40
30
20
150 °C
25 °C
8 Typ. forward transconductance
g
fs
=f(I
D
);
T
j
=25 °C
80
70
60
50
g
fs
[S]
0
1
2
3
4
5
I
D
[A]
40
30
20
10
0
0
10
20
30
40
50
60
10
0
V
GS
[V]
I
D
[A]
Rev. 1.01
page 5
2004-12-15
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