256Kx16 bit Low Power and Low Voltage CMOS Static RAM
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | TSOP2 |
package instruction | TSOP2-R, TSOP44,.46,32 |
Contacts | 44 |
Reach Compliance Code | compli |
ECCN code | 3A991.B.2.A |
Maximum access time | 70 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G44 |
length | 18.41 mm |
memory density | 4194304 bi |
Memory IC Type | STANDARD SRAM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2-R |
Encapsulate equivalent code | TSOP44,.46,32 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3 V |
Certification status | Not Qualified |
reverse pinout | YES |
Maximum seat height | 1.2 mm |
Minimum standby current | 2 V |
Maximum slew rate | 0.045 mA |
Maximum supply voltage (Vsup) | 3.3 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 10.16 mm |