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LP621024DX-55LL

Description
128K X 8 BIT CMOS SRAM
File Size185KB,16 Pages
ManufacturerAMICC [AMIC TECHNOLOGY]
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LP621024DX-55LL Overview

128K X 8 BIT CMOS SRAM

LP621024DX-55LL Related Products

LP621024DX-55LL LP621024DX-70LL LP621024DV-70LL LP621024DM-70LL LP621024DM-55LL LP621024DV-55LL LP621024D-70LL LP621024D-55LL LP621024D
Description 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM 128K X 8 BIT CMOS SRAM
Is it lead-free? - - Contains lead Contains lead Contains lead Contains lead - Contains lead -
Is it Rohs certified? - - incompatible incompatible incompatible incompatible - incompatible -
Maker - - AMICC [AMIC TECHNOLOGY] AMICC [AMIC TECHNOLOGY] AMICC [AMIC TECHNOLOGY] AMICC [AMIC TECHNOLOGY] - AMICC [AMIC TECHNOLOGY] -
Parts packaging code - - TSOP1 SOIC SOIC TSOP1 - DIP -
package instruction - - TSOP1, TSSOP32,.8,20 SOP, SOP32,.56 SOP, SOP32,.56 TSOP1, TSSOP32,.8,20 - DIP, DIP32,.6 -
Contacts - - 32 32 32 32 - 32 -
Reach Compliance Code - - unknow unknow unknow unknow - unknow -
ECCN code - - EAR99 EAR99 EAR99 EAR99 - EAR99 -
Maximum access time - - 70 ns 70 ns 55 ns 55 ns - 55 ns -
I/O type - - COMMON COMMON COMMON COMMON - COMMON -
JESD-30 code - - R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 - R-PDIP-T32 -
length - - 18.4 mm 20.45 mm 20.45 mm 18.4 mm - 41.91 mm -
memory density - - 1048576 bi 1048576 bi 1048576 bi 1048576 bi - 1048576 bi -
Memory IC Type - - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM - STANDARD SRAM -
memory width - - 8 8 8 8 - 8 -
Number of functions - - 1 1 1 1 - 1 -
Number of terminals - - 32 32 32 32 - 32 -
word count - - 131072 words 131072 words 131072 words 131072 words - 131072 words -
character code - - 128000 128000 128000 128000 - 128000 -
Operating mode - - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS -
Maximum operating temperature - - 70 °C 70 °C 70 °C 70 °C - 70 °C -
organize - - 128KX8 128KX8 128KX8 128KX8 - 128KX8 -
Output characteristics - - 3-STATE 3-STATE 3-STATE 3-STATE - 3-STATE -
Package body material - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY -
encapsulated code - - TSOP1 SOP SOP TSOP1 - DIP -
Encapsulate equivalent code - - TSSOP32,.8,20 SOP32,.56 SOP32,.56 TSSOP32,.8,20 - DIP32,.6 -
Package shape - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR -
Package form - - SMALL OUTLINE, THIN PROFILE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE - IN-LINE -
Parallel/Serial - - PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL -
Peak Reflow Temperature (Celsius) - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
power supply - - 5 V 5 V 5 V 5 V - 5 V -
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified -
Maximum seat height - - 1.2 mm 3 mm 3 mm 1.2 mm - 5.33 mm -
Maximum standby current - - 0.00001 A 0.00001 A 0.00001 A 0.00001 A - 0.00001 A -
Minimum standby current - - 2 V 2 V 2 V 2 V - 2 V -
Maximum slew rate - - 0.07 mA 0.07 mA 0.07 mA 0.07 mA - 0.07 mA -
Maximum supply voltage (Vsup) - - 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V -
Minimum supply voltage (Vsup) - - 4.5 V 4.5 V 4.5 V 4.5 V - 4.5 V -
Nominal supply voltage (Vsup) - - 5 V 5 V 5 V 5 V - 5 V -
surface mount - - YES YES YES YES - NO -
technology - - CMOS CMOS CMOS CMOS - CMOS -
Temperature level - - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL -
Terminal form - - GULL WING GULL WING GULL WING GULL WING - THROUGH-HOLE -
Terminal pitch - - 0.5 mm 1.27 mm 1.27 mm 0.5 mm - 2.54 mm -
Terminal location - - DUAL DUAL DUAL DUAL - DUAL -
Maximum time at peak reflow temperature - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -
width - - 8 mm 11.3 mm 11.3 mm 8 mm - 15.24 mm -

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