LP621024DX-70LL datasheet, PDF

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LP621024DX-70LL: Description128K X 8 BIT CMOS SRAM; File Size185KB，16 Pages; ManufacturerAMICC [AMIC TECHNOLOGY]

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LP621024DX-70LL Overview

128K X 8 BIT CMOS SRAM

LP621024DX-70LL Related Products

	LP621024DX-70LL	LP621024DV-70LL	LP621024DM-70LL	LP621024DM-55LL	LP621024DX-55LL	LP621024DV-55LL	LP621024D-70LL	LP621024D-55LL	LP621024D
Description	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM	128K X 8 BIT CMOS SRAM
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	-	Contains lead	-	Contains lead	-
Is it Rohs certified?	-	incompatible	incompatible	incompatible	-	incompatible	-	incompatible	-
Maker	-	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	AMICC [AMIC TECHNOLOGY]	-	AMICC [AMIC TECHNOLOGY]	-	AMICC [AMIC TECHNOLOGY]	-
Parts packaging code	-	TSOP1	SOIC	SOIC	-	TSOP1	-	DIP	-
package instruction	-	TSOP1, TSSOP32,.8,20	SOP, SOP32,.56	SOP, SOP32,.56	-	TSOP1, TSSOP32,.8,20	-	DIP, DIP32,.6	-
Contacts	-	32	32	32	-	32	-	32	-
Reach Compliance Code	-	unknow	unknow	unknow	-	unknow	-	unknow	-
ECCN code	-	EAR99	EAR99	EAR99	-	EAR99	-	EAR99	-
Maximum access time	-	70 ns	70 ns	55 ns	-	55 ns	-	55 ns	-
I/O type	-	COMMON	COMMON	COMMON	-	COMMON	-	COMMON	-
JESD-30 code	-	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	-	R-PDSO-G32	-	R-PDIP-T32	-
length	-	18.4 mm	20.45 mm	20.45 mm	-	18.4 mm	-	41.91 mm	-
memory density	-	1048576 bi	1048576 bi	1048576 bi	-	1048576 bi	-	1048576 bi	-
Memory IC Type	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM	-	STANDARD SRAM	-
memory width	-	8	8	8	-	8	-	8	-
Number of functions	-	1	1	1	-	1	-	1	-
Number of terminals	-	32	32	32	-	32	-	32	-
word count	-	131072 words	131072 words	131072 words	-	131072 words	-	131072 words	-
character code	-	128000	128000	128000	-	128000	-	128000	-
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	-	ASYNCHRONOUS	-
Maximum operating temperature	-	70 °C	70 °C	70 °C	-	70 °C	-	70 °C	-
organize	-	128KX8	128KX8	128KX8	-	128KX8	-	128KX8	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	-	3-STATE	-	3-STATE	-
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
encapsulated code	-	TSOP1	SOP	SOP	-	TSOP1	-	DIP	-
Encapsulate equivalent code	-	TSSOP32,.8,20	SOP32,.56	SOP32,.56	-	TSSOP32,.8,20	-	DIP32,.6	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR	-
Package form	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE	-	IN-LINE	-
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	-	PARALLEL	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	-
power supply	-	5 V	5 V	5 V	-	5 V	-	5 V	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	-
Maximum seat height	-	1.2 mm	3 mm	3 mm	-	1.2 mm	-	5.33 mm	-
Maximum standby current	-	0.00001 A	0.00001 A	0.00001 A	-	0.00001 A	-	0.00001 A	-
Minimum standby current	-	2 V	2 V	2 V	-	2 V	-	2 V	-
Maximum slew rate	-	0.07 mA	0.07 mA	0.07 mA	-	0.07 mA	-	0.07 mA	-
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	-	5.5 V	-	5.5 V	-
Minimum supply voltage (Vsup)	-	4.5 V	4.5 V	4.5 V	-	4.5 V	-	4.5 V	-
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	-	5 V	-	5 V	-
surface mount	-	YES	YES	YES	-	YES	-	NO	-
technology	-	CMOS	CMOS	CMOS	-	CMOS	-	CMOS	-
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	-	COMMERCIAL	-
Terminal form	-	GULL WING	GULL WING	GULL WING	-	GULL WING	-	THROUGH-HOLE	-
Terminal pitch	-	0.5 mm	1.27 mm	1.27 mm	-	0.5 mm	-	2.54 mm	-
Terminal location	-	DUAL	DUAL	DUAL	-	DUAL	-	DUAL	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	-
width	-	8 mm	11.3 mm	11.3 mm	-	8 mm	-	15.24 mm	-

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