• Transformer Coupled Across 70 ohms, Measured on Stub:
• BU-63147/157XX-XX0
• BU-63147X3-XX2 (Note 9)
Output Noise, Differential (Direct Coupled)
Output Offset Voltage, Transformer Coupled Across 70 ohms
Rise/Fall Time
• BU-63147/157X3
• BU-63147X4
LOGIC
V
IH
V
IL
I
IH
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
I
IL
Tx
Data In
, Tx
Inhibit
, Rx
Strobe
V
OH
(Vcc=4.75V,I
OH
=max)
V
OL
(Vcc=4.75V,I
OH
=max)
I
OL
I
OH
6
18
20
-250
100
200
7
20
22
150
150
250
9
27
27
10
250
300
300
Vp-p
Vp-p
Vp-p
mVp-p, diff
mVp-p, diff
ns
ns
2.0
20
-100
2.4
0.4
3.4
-3.4
0.8
100
-20
V
V
µA
µA
V
V
mA
mA
POWER SUPPLY REQUIREMENTS
Voltages/Tolerances
• +5V
Current Drain (Total Hybrid)
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
4.75
5.0
80
199
286
455
80
210
308
500
5.25
100
229
348
535
100
240
370
580
V
mA
mA
mA
mA
mA
mA
mA
mA
Data Device Corporation
www.ddc-web.com
3
BU-63147
P-07/12-0
TABLE 1. BU-63147/157 SPECIFICATIONS (CONT.)
PARAMETER
POWER DISSIPATION (NOTE 10)
Total Hybrid
BU-63147/157/XX-XX0
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (Both Channels)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
Hottest Die
BU-63147/157/XX-XX0
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
BU-63147/X3-XX2
• Idle (One Channel)
• 25% Transmitter Duty Cycle (One Channel)
• 50% Transmitter Duty Cycle (One Channel)
• 100% Transmitter Duty Cycle (One Channel)
THERMAL
• Thermal Resistance, Junction-to-Case, Hottest Die (θ
JC
)
• Operating Junction Temperature
• Storage Temperature
• Lead Temperature (soldering, 10 sec.)
PHYSICAL CHARACTERISTICS
Size
36-Pin DIP
36-Lead Flat pack
Weight
MIN
TYP
MAX
UNITS
0.4
0.65
0.73
0.88
0.4
0.7
0.84
1.1
0.2
0.43
0.59
0.78
0.2
0.48
0.7
1.00
0.5
0.8
1.04
1.28
0.5
0.85
1.15
1.50
0.25
0.6
0.84
1.13
0.25
0.65
0.95
1.35
12
150
150
+300
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
W
°C/W
°C
°C
°C
-55
-65
1.900 x .800 x .205
(48.26 x 20.32 x 5.21)
1.900 x .800 x .200
(48.26 x 20.32 x 5.08)
0.6
(17)
in.
(mm)
in.
(mm)
oz
(g)
Notes:
Notes 1 through 6 are applicable to the Receiver Differential Resistance and Differential Capacitance specifications:
(1) Specifications include both transmitter and receiver (assumed tied together externally).
(2) Impedance parameters are specified directly between pins TX/RX A(B) and TX/RX A(B) hybrid.
(3) It is assumed that all power and ground inputs to the hybrid are connected and that the hybrid case is connected to ground for the impedance measurement.
(4) The specifications are applicable for both unpowered and powered conditions.
(5) The specifications assume a 2 volt rms balanced, differential, sinusoidal input. The applicable frequency range is 75 kHz to 1 MHz.
(6) Minimum resistance and maximum capacitance parameters are guaranteed over the operating range, but are not tested.
(7) The Threshold Level, as referred to in this specification, is meant to be the maximum peak-to-peak voltage (measured on the data bus) that can be applied to the
receiver's input without causing the output to change from the OFF state.
(8) Assumes a common mode voltage within the frequency range of dc to 2 MHz, applied to pins of the isolation transformer on the stub side (either direct or transformer
coupled), and referenced to transceiver ground. Transformer must be a DDC recommended transformer or other transformer that provides an equivalent minimum
CMRR.
(9) MIL-STD-1760 requires minimum output voltage of 20 Vp-p on the stub connection. The -XX2 option is
not
available for the BU-63147X4 or BU-63157 versions.
(10) Power dissipation specifications assume a transformer coupled configuration, with external dissipation (while transmitting) of 0.14 watts for the active isolation trans-
former, 0.08 watts for the active coupling transformer, 0.45 watts for each of the two bus isolation resistors, and 0.15 watts for each of the two bus termination resistors.
(11) Assuming the use of isolation transformers with the turns ratios shown in Figure 3 and in the absence of common mode signal on the 1553 stub, this equates to a
nominal stub voltage of 38 Volts
PK-to-PK
transformer-coupled, or 53 Volts
PK-to-PK
direct-coupled.
Data Device Corporation
www.ddc-web.com
4
BU-63147
P-07/12-0
TABLE 2. BU-63157 RADIATION SPECIFICATIONS*
PART NUMBER
BU-63157X3
TOTAL DOSE
100 KRAD
SINGLE EVENT
LATCHUP
IMMUNE
INTRODUCTION
The BU-63147/157 is a dual redundant transmitter and receiver
packaged in a 36-pin DDIP or flat pack. It is directly compatible to
Harris 15530 encoder/decoder and has internal (factory preset)
threshold levels. The dual transceiver only requires +5V power
and conforms to MIL-STD-1553A and 1553B. For McAir compat-
ibility, versions are available with rise/fall times of 200 to 300
nsec.
Figure 3 illustrates the connection between a BU-63147/157
transceiver and a MIL-STD-1553 Data Bus. After transformer
isolating the transceiver, it can be either direct coupled (short
stub) or transformer coupled (long stub) to the Data Bus.
*Note: Radiation parameters specified on this data sheet are derived from initial
qualification testing by DDC and published data from ASIC manufacturers. These
devices have not been evaluated for compliance to the RHA requirements stipu-
lated in MIL-PRF-38534, Appendix G.
TABLE 3. HIGH RELIABILITY SCREENING OPTIONS
FOR BU-63157
ELEMENT EVALUATION
Visual Inspection:
Integrated Circuits
Transistor & Diodes
Passive Components
METHOD
TRANSMIT OPERATING MODE
MIL-STD-883, Method 2010 Condition A
MIL-STD-750, Method 2072 and 2073
MIL-STD-883, Method 2032 Class S
SEM Analysis for Integrated MIL-STD-883, Method 2018
Circuits
Element Evaluation:
Visual, Electrical, Wire
Bondability, 24-Hour
Stabilization Bake, 10
Temperature Cycles,
5000 g’s constant accelera-
tion, 240-Hour Powered
Burn-In and 1000-Hour Life
Test (Burn-In and 1000-
Hour Life Test are Only
Required for Active
Components.)
ASSEMBLY & TEST
Particle Impact Noise
Detection (PIND)
320-Hour Burn-In
(Standard on this device)
100% Non-Destructive
Wirebond Pull
(Standard on this device)
Radiographic (X-Ray)
Analysis
QCI TESTING
Extended Temperature
Cycling:
20 Cycles Including
Radiographic (X-Ray)
Testing
Moisture Content Limit of
5000 PPM
MIL-STD-883, Method 2020
Condition A
MIL-STD-883, Method 1015
The transmitter section accepts encoded TTL data and converts
it to phase-modulated bipolar form using a waveshaping network
and driver circuits. The driver outputs TX DATA OUT and TX DATA
OUT are transformer coupled to the Data Bus.
The transmitter output terminals can be put into a high imped-
ance state by setting INHIBIT high, or setting TX DATA IN and TX
DATA IN to the same logic level. The operating modes are shown
in TABLE 4.
The transceivers are able to operate in a “wraparound” mode.
This allows output data to be monitored by the receiver section
and returned to the decoder where it is checked for errors.
MIL-PRF-38534
TABLE 4. TRANSMIT OPERATING MODE
TX DATA IN
X
0
0
MIL-STD-883, Method 2023
1
1
MIL-STD-883, Method 2012
TX DATA IN
X
0
1
0
1
TX INHIBIT
H
X
L
L
X
DRIVER OUTPUT
OFF (NOTE)
OFF
TX DATA OUT ON,
TX DATA OUT OFF
TX DATA OUT ON,
TX DATA OUT OFF
OFF
NOTE: DRIVER OUTPUT terminals are in the high impedance mode during
[font=微软雅黑][size=4][color=darkorange][b]Download the latest trend report[/b][/color][/size][/font] [font=微软雅黑][b]Introduction:[/b]The global electric motor and generator market has grown steadily over...
[i=s]This post was last edited by chrisrh on 2019-1-19 14:55[/i] [size=5][color=#ff8c00]To do your work well, you must first sharpen your tools;[/color][/size][size=5][color=#ff8c00] [/color][/size][s...
For the first 100 years of power tool development, drills, sanders, grinders, screwdrivers, blowers, saws, and more all that was needed was a power source, a motor, and a switch/potentiometer. However...
Because I played too much with MCU in the past, now when I get some simple small boards, I don’t know how to continue for a while (laughs). I would like to ask netizens how to play with them?
Some typ...
Deep Learning Theory (National Taiwan University, Li Hongyi, Chinese) : https://training.eeworld.com.cn/course/4922Reprinted from: Reprinted from: https://www.youtube.com/watch?v=KKT2VkTdFyclist=PLJV_...
Serial port debugging softwareXCOM V2.2 of Atomic PunctualityVirtual serial port softwareVirtual Serial Port Driver 7.2Serial port monitoring softwareCommMonitor_111200...
In smart car racing and various smart car applications, the smart car needs to move quickly along a certain track. Ordinary infrared sensors, laser sensors, and camera recognition can effectively e...[Details]
The author analyzes and solves the problem that TIM3 cannot be used to output 2-way PWM waves when using STM32F103C8T6. PS. PB4 (partial remapping, TIM3_CH1), PB5 (partial remapping, TIM3_CH2) STM...[Details]
Pseudo-instruction Note: Pseudo-instructions may vary greatly between different IDEs, but assembly instructions are the same; Pseudo-operation identifier: Function: Complete various preparations f...[Details]
Multisim is a circuit simulation software based on SPICE. SPICE (Simulation Program with Integrated Circuit Emphasis) is the abbreviation of "Simulation Program with Focus on Integrated Circuits"...[Details]
The emulator I use is Fire-Debugger, which supports ARM's CMSIS-DAP standard as shown in the figure below. We connect the emulator to the development board and the computer, then power on the de...[Details]
In DC to low frequency sensor signal conditioning applications, the common mode rejection ratio (CMRR) of the instrumentation amplifier alone is not enough to provide robust noise suppression in ...[Details]
1. Create a new DEMO folder 2. Click New File in KeilC51 3. Name the project and save it in the DEMO folder 4. Select the chip device (we choose AT89C52 chip) 5. Add startup file (STARTUP.A51...[Details]
Introduction: I am still on vacation at home today. After sending Yanyan to work, I have time to carefully check the information of Model Y. At present, it seems that the 100-meter wiring harness is ...[Details]
In terms of chip manufacturing technology, TSMC, which manufactures chips for Apple and other companies, has been at the forefront of the industry in recent years. Their 7nm and 5nm processes were th...[Details]
Despite Japan's strong preference for domestic brands, Korean OLED panels and OLED TVs still occupy a high market share in the Japanese market. South Korean media businesskorea reported that LG Ele...[Details]
On the evening of October 30, JinkoSolar (601778.SH) released its third quarter report for 2022. The report shows that the company's revenue in the third quarter was 993 million yuan; the net profit a...[Details]
According to Cailianshe, after Apple removed OFILM from its supply chain list, most of OFILM's original touch screen orders have been taken over by Lens Technology. This morning, the Hong Kong Econo...[Details]
MB89160/160A is a new 8-bit microcontroller series launched by Fujitsu of Japan. Because it adopts CMOS technology, high-density integrated process and modular structure, it has the characteristics...[Details]
According to Jiwei.com, Acer announced today that it will acquire the common shares of Taiwan's touch screen chip manufacturer Dontech for a total amount not exceeding NT$1.5 billion (and RMB 347 mil...[Details]
Recently, at a busy energy storage power station construction site, the 2.5MW liquid-cooled energy storage inverter innovatively launched by Kehua Digital Energy is being installed in an orderly ma...[Details]
Sensor
京公网安备 11010802033920号
EEWORLD
