|
3DFN4G08VS1470MSP-00 |
3DFN4G08VS1470IBH-00 |
3DFN4G08VS1470MS-00 |
Description |
Flash, 512MX8, PDSO50, SOP-50 |
Flash, 512MX8, PDSO50, SOP-50 |
Flash, 512MX8, PDSO50, SOP-50 |
Maker |
3D PLUS |
3D PLUS |
3D PLUS |
package instruction |
SSOP, |
SSOP, |
SSOP, |
Reach Compliance Code |
unknown |
unknown |
unknown |
JESD-30 code |
R-PDSO-G50 |
R-PDSO-G50 |
R-PDSO-G50 |
length |
18.7 mm |
18.7 mm |
18.7 mm |
memory density |
4294967296 bit |
4294967296 bit |
4294967296 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
memory width |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
50 |
50 |
50 |
word count |
536870912 words |
536870912 words |
536870912 words |
character code |
512000000 |
512000000 |
512000000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
85 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-40 °C |
-55 °C |
organize |
512MX8 |
512MX8 |
512MX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SSOP |
SSOP |
SSOP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
Programming voltage |
2.7 V |
2.7 V |
2.7 V |
Maximum seat height |
4.1 mm |
4.1 mm |
4.1 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
INDUSTRIAL |
MILITARY |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
width |
13.64 mm |
13.64 mm |
13.64 mm |
Base Number Matches |
1 |
1 |
- |