HYM641020GS-70 datasheet, PDF - EEWORLD Datasheet

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HYM641020GS-70: Description1M x 64-Bit Dynamic RAM Module; Categorystorage storage; File Size82KB，11 Pages; ManufacturerSIEMENS; Websitehttp://www.infineon.com/

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HYM641020GS-70 Overview

1M x 64-Bit Dynamic RAM Module

HYM641020GS-70 Parametric

Parameter Name	Attribute value
Maker	SIEMENS
Objectid	1417193085
Parts packaging code	DIMM
package instruction	,
Contacts	168
Reach Compliance Code	unknow
ECCN code	EAR99
compound_id	9654349
access mode	FAST PAGE
Maximum access time	70 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH
Spare memory width	32
JESD-30 code	R-XDMA-N168
memory density	67108864 bi
Memory IC Type	FAST PAGE DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	168
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
refresh cycle	1024
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal location	DUAL

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64-Bit Dynamic RAM Module

HYM 641010GS-60/-70

HYM 641020GS-60/-70

Advanced Information

•

1 048 576 words by 64-bit organization

Fast access and cycle time

60 ns access time

110 ns cycle time (-60 version)

70 ns access time

130 ns cycle time (-70 version)

Fast page mode capability with

40 ns cycle time (-60 version)

45 ns cycle time (-70 version)

Single + 5 V (± 10 %) supply

Low power dissipation

max. 9680 mW active (-60 version)

max. 8800 mW active (-70 version)

CMOS – 451 mW standby

TTL

– 550 mW standby

•

CAS-before-RAS refresh, RAS-only-refresh

Byte Write Capability

16 decoupling capacitors mounted on substrate

All inputs, outputs and clock fully TTL compatible

4 Byte interleave enabled, Dual Address inputs (A0/B0)

Buffered inputs except RAS and DQ

168 pin, dual read-out, Single in-Line Memory Module

Utilizes sixteen 1M

4 -DRAMs (HYB 514400BJ/BT) and

four BiCMOS 8-bit buffers/line drivers 74ABT244

Two version : HYM 641010GS with SOJ-components (8.89 mm module thickness)

HYM 641020GS with TSOPII-components (4.06 mm module thickness)

1024 refresh cycles / 16 ms

Optimized for use in byte-write non-parity applications

Gold contact pads,double sided module with 25.35 mm (1000 mil) height

•

Semiconductor Group

12.95

HYM641020GS-70 Related Products

	HYM641020GS-70	Q67100-Q2003	Q67100-Q2002	HYM641010GS-60	HYM641010GS-70	HYM641010GS-60-	HYM641020GS-60
Description	1M x 64-Bit Dynamic RAM Module	1M x 64-Bit Dynamic RAM Module	1M x 64-Bit Dynamic RAM Module	1M x 64-Bit Dynamic RAM Module	1M x 64-Bit Dynamic RAM Module	1M x 64-Bit Dynamic RAM Module	1M x 64-Bit Dynamic RAM Module
Maker	SIEMENS	-	-	SIEMENS	SIEMENS	-	SIEMENS
Parts packaging code	DIMM	-	-	DIMM	DIMM	-	DIMM
Contacts	168	-	-	168	168	-	168
Reach Compliance Code	unknow	-	-	unknow	unknow	-	unknow
ECCN code	EAR99	-	-	EAR99	EAR99	-	EAR99
access mode	FAST PAGE	-	-	FAST PAGE	FAST PAGE	-	FAST PAGE
Maximum access time	70 ns	-	-	60 ns	70 ns	-	60 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH	-	-	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	-	RAS ONLY/CAS BEFORE RAS REFRESH
Spare memory width	32	-	-	32	32	-	32
JESD-30 code	R-XDMA-N168	-	-	R-XDMA-N168	R-XDMA-N168	-	R-XDMA-N168
memory density	67108864 bi	-	-	67108864 bi	67108864 bi	-	67108864 bi
Memory IC Type	FAST PAGE DRAM MODULE	-	-	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	-	FAST PAGE DRAM MODULE
memory width	64	-	-	64	64	-	64
Number of functions	1	-	-	1	1	-	1
Number of ports	1	-	-	1	1	-	1
Number of terminals	168	-	-	168	168	-	168
word count	1048576 words	-	-	1048576 words	1048576 words	-	1048576 words
character code	1000000	-	-	1000000	1000000	-	1000000
Operating mode	ASYNCHRONOUS	-	-	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	70 °C	-	-	70 °C	70 °C	-	70 °C
organize	1MX64	-	-	1MX64	1MX64	-	1MX64
Output characteristics	3-STATE	-	-	3-STATE	3-STATE	-	3-STATE
Package body material	UNSPECIFIED	-	-	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	-	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	-	-	Not Qualified	Not Qualified	-	Not Qualified
refresh cycle	1024	-	-	1024	1024	-	1024
Maximum supply voltage (Vsup)	5.5 V	-	-	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	4.5 V	-	-	4.5 V	4.5 V	-	4.5 V
Nominal supply voltage (Vsup)	5 V	-	-	5 V	5 V	-	5 V
surface mount	NO	-	-	NO	NO	-	NO
technology	CMOS	-	-	CMOS	CMOS	-	CMOS
Temperature level	COMMERCIAL	-	-	COMMERCIAL	COMMERCIAL	-	COMMERCIAL
Terminal form	NO LEAD	-	-	NO LEAD	NO LEAD	-	NO LEAD
Terminal location	DUAL	-	-	DUAL	DUAL	-	DUAL

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