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XBCR05215601B

Description
Fixed Resistor, Thin Film, 0.25W, 15600ohm, 75V, 0.1% +/-Tol, 250ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size98KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

XBCR05215601B Overview

Fixed Resistor, Thin Film, 0.25W, 15600ohm, 75V, 0.1% +/-Tol, 250ppm/Cel, Surface Mount, 0202, CHIP

XBCR05215601B Parametric

Parameter NameAttribute value
MakerVishay
package instructionCHIP
Reach Compliance Codeunknown
ECCN codeEAR99
Manufacturer's serial numberBCR
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance15600 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient250 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.1%
Operating Voltage75 V
Base Number Matches1
BCR
Vishay Electro-Films
Thin Film, Back-Contact Resistor
CHIP
RESISTORS
FEATURES
Wire bondable
Product may not
be to scale
Only one wire bond required
Small size: 0.020 inches square.
Resistance range: 10
Ω
to 1 MΩ
Oxidized silicon substrate for good power dissipation
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
Resistor material: Tantalum nitride, self-passivating
Moisture resistant
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
PROCESS CODE
CLASS H*
CLASS K*
056
061
059
052
010
002
027
008
*MIL-PRF-38534 inspection criteria
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
360 kΩ
1 MΩ
200 kΩ
620 kΩ
10
Ω
20
Ω
50
Ω
100
Ω
200
Ω
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
www.vishay.com
54
For technical questions, contact: efi@vishay.com
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 1.0 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
200 V
10
12
min.
75 V max.
250 mW
± 0.25 % max.
ΔR/R
Document Number: 61023
Revision: 12-Mar-08
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