32 Mbit 4Mb x8 or 2Mb x16 OTP EPROM
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | STMicroelectronics |
Parts packaging code | TSOP |
package instruction | 12 X 20 MM, PLASTIC, TSOP-48 |
Contacts | 48 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Maximum access time | 150 ns |
Spare memory width | 8 |
I/O type | COMMON |
JESD-30 code | R-PDSO-G48 |
JESD-609 code | e3 |
length | 18.4 mm |
memory density | 33554432 bi |
Memory IC Type | OTP ROM |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP48,.8,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum standby current | 0.00006 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.63 V |
Minimum supply voltage (Vsup) | 2.97 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 12 mm |