MH25708J-10 datasheet, PDF - EEWORLD Datasheet

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MH25708J-10: DescriptionDRAM Module, 256KX8, 100ns, NMOS, SIMM-30; Categorystorage storage; File Size326KB，9 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH25708J-10 Overview

DRAM Module, 256KX8, 100ns, NMOS, SIMM-30

MH25708J-10 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	SIMM
package instruction	SIMM, SIM30
Contacts	30
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	NIBBLE
Maximum access time	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-XSMA-N30
memory density	2097152 bit
Memory IC Type	DRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	30
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SIM30
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	256
Maximum seat height	17.272 mm
Maximum slew rate	0.52 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	NMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	2.54 mm
Terminal location	SINGLE
Base Number Matches	1

MH25708J-10 Related Products

	MH25708J-10	MH25708J-85	MH25708JA-10	MH25708J-15	MH25708J-12	MH25708JA-12	MH25708JA-15	BD90610HFP-E2
Description	DRAM Module, 256KX8, 100ns, NMOS, SIMM-30	DRAM Module, 256KX8, 85ns, NMOS, SIMM-30	DRAM Module, 256KX8, 100ns, NMOS, SIMM-30	DRAM Module, 256KX8, 150ns, NMOS, SIMM-30	DRAM Module, 256KX8, 120ns, NMOS, SIMM-30	DRAM Module, 256KX8, 120ns, NMOS, SIMM-30	DRAM Module, 256KX8, 150ns, NMOS, SIMM-30	1ch Step-Down Switching Regulator
Maker	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	-
Parts packaging code	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	-
package instruction	SIMM, SIM30	SIMM, SIM30	, SIP30,.2	SIMM, SIM30	SIMM, SIM30	, SIP30,.2	, SIP30,.2	-
Contacts	30	30	30	30	30	30	30	-
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	-
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-
access mode	NIBBLE	NIBBLE	NIBBLE	NIBBLE	NIBBLE	NIBBLE	NIBBLE	-
Maximum access time	100 ns	85 ns	100 ns	150 ns	120 ns	120 ns	150 ns	-
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	-
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-
JESD-30 code	R-XSMA-N30	R-XSMA-N30	R-XSMA-T30	R-XSMA-N30	R-XSMA-N30	R-XSMA-T30	R-XSMA-T30	-
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	-
Memory IC Type	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	-
memory width	8	8	8	8	8	8	8	-
Number of functions	1	1	1	1	1	1	1	-
Number of ports	1	1	1	1	1	1	1	-
Number of terminals	30	30	30	30	30	30	30	-
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	-
character code	256000	256000	256000	256000	256000	256000	256000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	-
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	-
Encapsulate equivalent code	SIM30	SIM30	SIP30,.2	SIM30	SIM30	SIP30,.2	SIP30,.2	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	-
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
refresh cycle	256	256	256	256	256	256	256	-
Maximum seat height	17.272 mm	17.272 mm	18.034 mm	17.272 mm	17.272 mm	18.034 mm	18.034 mm	-
Maximum slew rate	0.52 mA	0.56 mA	0.52 mA	0.44 mA	0.48 mA	0.48 mA	0.44 mA	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
surface mount	NO	NO	NO	NO	NO	NO	NO	-
technology	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	NMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
Terminal form	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	-
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	-
Base Number Matches	1	1	1	1	1	-	-	-

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