S29PL032J55BAW133 datasheet, PDF

S29PL032J55BAW133: DescriptionFlash, 2MX16, 55ns, PBGA56, 7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56; Categorystorage storage; File Size944KB，100 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29PL032J55BAW133 Overview

Flash, 2MX16, 55ns, PBGA56, 7 X 9 MM, LEAD FREE COMPLIANT, FBGA-56

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	BGA, BGA56,8X8,32
Contacts	56
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	55 ns
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B56
JESD-609 code	e3
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,62
Number of terminals	56
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA56,8X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY
page size	8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Department size	4K,32K
Maximum standby current	0.000005 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	MATTE TIN
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
Base Number Matches	1

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