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AM27C256-300DCB

Description
UVPROM, 32KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Categorystorage    storage   
File Size374KB,15 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric View All

AM27C256-300DCB Overview

UVPROM, 32KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

AM27C256-300DCB Parametric

Parameter NameAttribute value
MakerAMD
Parts packaging codeDIP
package instructionWDIP,
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time300 ns
JESD-30 codeR-GDIP-T28
length37.1475 mm
memory density262144 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals28
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeWDIP
Package shapeRECTANGULAR
Package formIN-LINE, WINDOW
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.588 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1
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