EEWORLDEEWORLDEEWORLD

Part Number

Search

MB22101KAN

Description
HIGH FREQUENCY CERAMIC CAPACITORS
File Size164KB,6 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Download Datasheet View All

MB22101KAN Overview

HIGH FREQUENCY CERAMIC CAPACITORS

APPLICATION SPECIFIC CAPACITORS
HIGH FREQUENCY CERAMIC CAPACITORS
MA/MB Series
OUTSTANDING CHARACTERISTICS
I
Miniature size
I
Very high Q at high frequencies
I
High RF power capabilities
I
Impervious to environmental conditions
I
Low dissipation factors
I
Excellent retrace capability (not applicable for X7R styles)
I
High temperature stability
I
Low noise
I
Meets Mil-55681 with respect to: Shock, Vibration,
Moisture Resistance, Solderability, Barometric Pressure,
Temperature Cycling, Immersion and Salt Spray
ADDITIONAL FEATURES
I
Packaging options
I
Lot processing data available
MA SERIES
For filtering, coupling and impedance matching in most
RF circuits, the MA Series chips and leaded devices offer
outstanding performance and reliability with the greatest
range of values and configurations. MA Series capacitors
can be supplied with military equivalent screening. Please
consult our factory.
MA Series ceramic fixed capacitors are miniature, high
performance precision components having extremely high Q
and high power capabilities from low frequencies to gigahertz
ranges. These “low loss” multilayer capacitors are extremely
stable with respect to variations in temperature, voltage and
frequency.
MA Series capacitors are designed for miniature
state-of-the-art circuit applications. They are small,
easy to apply and have excellent reliability. Units are
available in ultra-miniature case size 1 (1.4 x 1.4 x 1.4mm)
or miniature case size 2 (2.8 x 2.8 x 2.5mm). Standard
case size 1 units are available as chips. Standard case
size 2 units are available as chips and also in leaded
configurations.
Clean-room manufacturing technology assures product
reliability and automated processing reduces costs and
cycle time. Key stages of the operation are monitored
and controlled with the latest SPC techniques. Flexibility in
design allows the production of non-standard values, while
maintaining consistent quality objectives.
Please contact the factory for availability of special
configurations or high-reliability screening.
PART NUMBERING SYSTEM – CASE SIZE 1 & CASE SIZE 2
M
A
1
8
101
J
A
N
CUBIC
MONOLITHIC
A-STD SERIES
B-ULTRA
HIGH Q
DIMENSIONAL
AND T.C. CODE
1: P90 Case 1
5: COG Case 1
7: X7R Case 1
2: P90 Case 2
6: COG Case 2
8: X7R Case 2
TERMINATION
CODE:
0: Chip
1: Pellet
2: Microstrip
3: Radial Ribbon
4: Radial Wire
5: Axial Ribbon
6: Narrow Axial Ribbon
7: Axial Wire
8: Nickel Interfaced Pellet
9: Nickel Interfaced Chip
CAPACITANCE
TOLERANCES:
CODE:
Expressed
*B: ±0.1pF
in picofarads and
*C: ±0.25pF
identified by a three-digit *D: ±0.5pF
number. First two digits
F : ±1%
represent significant
G: ±2%
figures. Last digit
J : ±5%
specifies the number
K: ±10%
of zeros to follow. For
M: ±20%
values below 10pF,
Z: +80%, –20%
the letter “R” is used
as the decimal point
and the last digit
becomes significant.
A: NO
7” Reel
MARKING
Plastic
B: MARKING
Tape
Cap. Code
& Tol.
Logo if space
permits
Non XR7
styles only
*Available
below 10pf
only
SPECIAL LEAD CONFIGURATION FOR FLEX BOARDS
NOTE:
Targeted for flex circuit boards, the MA22-6 version of the MA22 has an upraised lead configuration. The lead bends
when flexing the board after assembly so that minimal stress is placed on the component.
Type
Style
P90 ± 20 P90 ± 30
COG
X7R
Configuration
W
L
T
Dimensions: mm
L ± 0.38* W ± 0.38* T ± .038
Band
Y
Termination
Silver Ribbon:
W
NE
Raised
Micro-Strip
MA22-6 MB22-6
MA62-6 MA82-6
Y
3.4
2.8
2.8
0.38 ± .25
Length: 6.35 typical
Width: 2.3 ± .13
Thickness: 0.1 ± .05
118
CG01-J
Free review: Chuanglong TL570x-EVM is here, TI AM5708 industrial board
Evaluation kit: TL570x-EVM (3 sets in total) Kit source: Tronlong TechnologyChuanglong Technology TL570x-EVM is a heterogeneous multi-core SoC evaluation board designed based on TI Sitara series AM570...
EEWORLD社区 TI Technology Forum
[Synopsys IP Resources] One data cable goes everywhere, USB4 fully accelerates the next generation of chips
Have you bought a USB flash drive recently? Have you ever noticed whether you bought USB 2.0, 3.0, 3.2 or 4? What exactly does USB mean here?USB is actually the key technology to achieve data transmis...
arui1999 Integrated technical exchanges
【CH579M-R1】+ driving LCD5110 display
After a day of debugging, the LCD5110 display finally drove successfully. The program was ported from STM32, and a logic analyzer was used to adjust the timing. During the debugging process, I made a ...
hujj Domestic Chip Exchange
Import 3D footprints into PCB library
Import 3D footprints into PCB libraryWhen we do PCB wiring, we sometimes ignore structural problems, as shown in the following figureIn the picture above, you can't see the specific structure at all.T...
tangdianzi PCB Design
What technology does 5G network use? Why is 5G network faster than 4G network?
In fact, it is not "5G is better than 4G", but "in order to be faster than 4G, the concept of 5G network was proposed". In fact, every generation of wireless communication network after 3G first propo...
兰博 RF/Wirelessly
[N32L43X Review] 7.PWM Test
[i=s]This post was last edited by 805721366 on 2022-7-31 09:18[/i]This article introduces the TIM3 timer output PWM test Hardware Hookup TIM3CH1 —— PA6 TIM3CH2 —— PA7Software Code The TIM3 output PWM ...
805721366 Domestic Chip Exchange

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号